Semiconductor chip and semiconductor package
一种半导体、芯片的技术，应用在半导体器件、半导体/固态器件零部件、电固体器件等方向，能够解决差动信号特性恶化等问题，达到提高差动特性的效果
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no. 1 approach
[0040] figure 1 It is a plan view showing an example of the structure of the semiconductor package 100 according to the first embodiment. also, figure 2 yes yes figure 1 The region F of the semiconductor package 100 shown is a plan view of an example of the structure of interest. also, image 3 yes means figure 2 It is a plan view showing an example of the connection relationship between the differential amplifier circuit and the pad electrode in each IO cell region shown.
[0041] In addition, in figure 1 In , the encapsulation resin, pad electrodes, bonding wires, and bonding fingers are omitted.
[0042] Such as figure 1 As shown, the semiconductor package 100 includes a semiconductor chip 1 and a base substrate 2 .
[0043] The base substrate 2 is made of, for example, an insulating material, and the semiconductor chip 1 can be mounted on the upper surface thereof. In addition, on the base substrate 2, the semiconductor chip 1 is packaged with a sealing resin (n...
no. 2 approach
[0108] Figure 8 is true figure 1 The region F of the illustrated semiconductor package 100 is a plan view of another example of the structure of interest. also, Figure 9 yes means Figure 8 It is a plan view showing an example of the connection relationship between the differential amplifier circuit and the pad electrode in each IO cell region shown.
[0109] and, if Figure 8 As shown, the group of the same-phase pad electrode and the reverse-phase pad electrode (the first group of the first common-phase pad electrode P1 and the first reverse-phase pad electrode N1, the second same-phase pad electrode P2 and the second group of the second inverting pad electrode N2, the third group of the third non-inverting pad electrode P3 and the third group of the third inverting pad electrode N3) are arranged in two along the side 1a of the semiconductor chip 1. Column(Y1, Y2).
[0110] In particular, the first in-phase pad electrode P1 and the first inversion pad electrode N1 of...
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