Unlock instant, AI-driven research and patent intelligence for your innovation.

Semiconductor package incorporating heat dispersion plate inside resin molding and fabrication method for the same

A technology for semiconductors and heat sinks, applied in the fields of semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc. Excellent, thermal resistance reduction effect

Inactive Publication Date: 2004-04-21
NEC ELECTRONICS CORP
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0014] First, the thermal resistance value is not significantly reduced because the gap 9 formed between the heat sink 7 and the island 2 after resin molding negatively affects the thermal conductivity between the island 2 and the heat sink 7
[0015] The second problem is the reduced reliability of the package (abbreviated as "PKG")
[0016] The third problem is that there is a possibility of an electrical short caused by the contact between the end of the inner lead 5 and the heat sink 7
[0018] However, the amount of indentation of the lead frame is usually on the order of 150-200 μm, which means that only a gap of 150-200 μm can be ensured between the inner lead 5 and the heat dissipation plate 7, when the flow of the resin forming the resin molded part 8 causes heat dissipation When the board 7 is offset (floating), a short circuit will occur between the inner lead 5 and the heat sink 7
[0019] As for the fourth problem, the large surface of the end of the leg 15 of the heat dissipation plate 7 exposed by the resin molded portion 8 leads to a decrease in moisture resistance of the package.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semiconductor package incorporating heat dispersion plate inside resin molding and fabrication method for the same
  • Semiconductor package incorporating heat dispersion plate inside resin molding and fabrication method for the same
  • Semiconductor package incorporating heat dispersion plate inside resin molding and fabrication method for the same

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0061] Referring to 4A and 4B, the semiconductor package of this embodiment has a structure in which lead frame unit 27 is laminated on heat dissipation plate 7 as in the prior art. In this embodiment, however, the island 2 is supported by bumps 18 formed on the heat dissipation plate 7 . A gap is formed between the island 2 and the heat dissipation plate 7 by the protrusions 18, and the gap is filled with the resin forming the resin molded portion 8 to bond the island 2 and the heat dissipation plate 7 together. In addition, the structure of the lead frame unit 27, the method of fixing the semiconductor element 1 to the island 2, and the method of connecting the electrodes on the semiconductor element 1 to the inner leads 5 are the same as those in the prior art.

[0062] The legs 15 of the heat sink 7 are formed by bending tabs made of copper alloy or 42 alloy (Cu-42%Zn) on a circular or square thin plate of 0.1-0.2 mm thick, as shown in FIGS. 5A and 5B . The ends of the le...

no. 2 example

[0075] Referring to 7A and 7B, the semiconductor package of this embodiment has a structure in which the lead frame unit 27 is laminated on the heat dissipation plate 7 as in the prior art. However, in this embodiment, the island 2 and the heat dissipation plate 7 are bonded by coating or applying a thermoplastic resin 19 to the heat dissipation plate 7 . Other than that, the structure of the lead frame unit 27, the method of fixing the semiconductor element 1 to the island 2, and the method of connecting the electrodes on the semiconductor element 1 to the inner leads 5 are the same as in the prior art.

[0076] As shown in FIGS. 8A and 8B, the legs 15 of the heat sink 7 are formed by bending a tab made of copper alloy or 42 alloy (Cu-42%Zn) on a circular or square thin plate of 0.1-0.2 mm thick. The ends of the legs 15 are processed so as to be parallel to the mounting surface of the heat sink plate 7 .

[0077] A thermoplastic resin 19 composed of polyimide resin is applie...

no. 3 example

[0086] Referring to 10A and 10B, the semiconductor package of this embodiment has a structure in which lead frame unit 27 is laminated on heat dissipation plate 7 as in the prior art. However, in this embodiment, the island 2 and the heat dissipation plate 7 are bonded by coating or applying the thermosetting resin 20 on the heat dissipation plate 7 . In other words, the thermoplastic resin 19 used in the second embodiment is replaced with the thermosetting resin 20 in this embodiment.

[0087] In addition, the structure of the lead frame unit 27, the method of fixing the semiconductor element 1 to the island 2, and the method of connecting the electrodes on the semiconductor element 1 to the inner leads 5 are the same as those in the prior art.

[0088] As shown in FIGS. 11A and 11B , the legs 15 of the heat sink 7 are formed by bending a tab made of copper alloy or 42 alloy (Cu-42%Zn) on a circular or square thin plate of 0.1-0.2 mm thick. The ends of the legs 15 are proces...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Melting pointaaaaaaaaaa
Surface areaaaaaaaaaaa
Login to View More

Abstract

The resin-molded portion of a semiconductor package encapsulates a semiconductor element mounting portion, inner leads, and a heat dispersion plate. A semiconductor element is mounted on the surface of the semiconductor element mounting portion. The inner leads are arranged around the perimeter of the semiconductor element and are electrically connected to electrodes on the surface of the semiconductor element. The heat dispersion plate has legs, and the semiconductor element mounting portion is arranged to overlap with the heat dispersion plate. A bonding layer composed of thermoplastic resin, thermosetting resin, or low-melting metal is present at least between the heat dispersion plate and the semiconductor element mounting portion. A portion of the legs of the heat dispersion plate is exposed on the bottom surface of the resin-molded portion. Outer leads that are continuous with the inner leads extend outside the resin-molded portion.

Description

technical field [0001] The present invention relates to a semiconductor package with low thermal resistance, and more particularly, to a semiconductor package incorporating a heat dissipation plate into a resin molded portion. Background technique [0002] First, description will be made with reference to FIGS. 1A and 1B . 1A and 1B are related to the prior art semiconductor package structure with low thermal resistance. This type of semiconductor package has, for example, a structure in which lead frame unit 27 is layered on heat dissipation plate 7 . [0003] The lead frame unit 27 includes: the outer lead 6 drawn out from the resin molded part 8; the inner lead 5 extending from the outer lead 6 into the resin molded part 8; the island 2, which is a mounting part of the semiconductor element 1; The cantilever 4 of the island 2 is fixed prior to the molding process. [0004] The semiconductor element 1 is fixed by a conductive adhesive such as silver solder paste on the ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L23/28H01L21/56H01L23/29H01L23/433
CPCH01L23/4334H01L24/49H01L2924/01078H01L24/48H01L2224/49171H01L21/565H01L2224/48247H01L2224/48091H01L2224/73265H01L2924/00014H01L2924/181H01L2924/00H01L2924/00012H01L2224/45099H01L2224/05599H01L2224/85399H01L2224/45015H01L2924/207H01L23/28
Inventor 稻叶健仁
Owner NEC ELECTRONICS CORP