Modules with both heat conduction and heat dissipation functions for integrated circuits or optoelectronic components
A technology of integrated circuits and photoelectric components, which is applied in the field of modules with both heat conduction and heat dissipation functions, can solve the problems of wasting heat sink space, the heat sink material cannot be loaded with fixtures for a long time, and cracks, so as to increase the efficiency of heat dissipation Effect
Inactive Publication Date: 2018-12-11
ENRAYTEK OPTOELECTRONICS
View PDF3 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0006] However, in the prior art, the jig is used to stretch the periphery of the groove, so that the diameter of the inner edge of the groove is larger than that of the heat pipe, so that the heat pipe can pass through the groove, and the elasticity of the heat sink material is exhausted. or rupture, and the material of the heat sink may not be able to bear the force exerted by the fixture for a long time
In addition, after the jig is removed, the slit position wastes the space of the heat sink that can conduct heat, which affects the heat dissipation efficiency and decreases
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0027] What needs to be explained here is that although some specific words are used to refer to specific elements throughout the specification (including claims) of this application, those of ordinary skill in the technical field to which this application belongs should understand that certain manufacturers It is possible to refer to the same element by different terms. Therefore, when understanding the entirety of the specification (including the claims) of this application, the difference in names should not be used as a way to distinguish elements, but the difference in function of elements should be used as a criterion for distinguishing. In addition, the words "including" and "having" used throughout the specification of this application are both open-ended terms, so they should be interpreted as "including but not limited to".
[0028] A detailed description will be given below of a module for integrated circuits or optoelectronic components having both heat conduction ...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention provides a heat conducting / dissipating module for an integrated circuit or an optoelectronics element. The module includes a module, a heat conducting device and a heat dissipation device. The heat dissipation device has a through hole and a through groove communicated with the through hole. In actual use, the heat conducting device is arranged in the through hole of the heat dissipation device in advance, and is then arranged in the through groove of the heat dissipation device in a penetrating manner via the module, so that the heat conducting device is tightly jointed in the heat dissipation device and the module, thereby achieving optimal heat dissipation efficiency. In addition, one ends of the module, the heat conducting device and the heat dissipation device form a coplane, and a heating element can be arranged on the coplane, thereby achieving a heat dissipation effect.
Description
technical field [0001] The present invention relates to a module for integrated circuits or photoelectric elements with both heat conduction and heat dissipation functions, and in particular, relates to a combined heat conduction and heat dissipation module. Background technique [0002] Driven by technology and new materials, the current production of semiconductor IC components, optoelectronic components, etc., not only have more and more powerful functions, but also their volume is becoming thinner and lighter. Therefore, while pursuing light weight and endowing high performance, The accompanying heat generated by semiconductor IC components, optoelectronic components, etc. is equally astonishing. Since the heat generated by semiconductor IC components, optoelectronic components, etc. will directly affect the operating performance and service life of semiconductor IC components, optoelectronic components, etc., heat management becomes a An important key to the development...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/367H01L23/427
Inventor 陈振贤叶荣富范哲骞
Owner ENRAYTEK OPTOELECTRONICS