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Film for forming protective film and composite sheet for forming protective film

A protective film, polymer technology, applied in applications, home appliances, other home appliances, etc., can solve problems such as poor transportation, wafer bending, poor shrinkage, etc., to achieve high reliability and correct the effect of bending

Active Publication Date: 2018-03-27
LINTEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In the past, when the wafer itself was sufficiently thick, the wafer itself did not bend, but as the wafer became thinner, the following problem occurred: the shrinkage ratio between the surface of the wafer with circuits formed and the back surface of the wafer without circuits Poor, resulting in bowing of the thinned wafer
[0006] Bending a large wafer may cause transportation failure in subsequent chip manufacturing steps
In addition, it may be difficult to cut the wafer due to the bending of the wafer

Method used

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  • Film for forming protective film and composite sheet for forming protective film
  • Film for forming protective film and composite sheet for forming protective film
  • Film for forming protective film and composite sheet for forming protective film

Examples

Experimental program
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Effect test

Embodiment

[0179] Hereinafter, although an Example demonstrates this invention, this invention is not limited to these Examples. In addition, in the following examples or comparative examples, , , , and .

[0180]

[0181] Laminate 4 films for forming a protective film with a thickness of 45 μm, heat-cure in an oven in an air atmosphere (130°C for 2 hours), and produce a test strip cut into a strip with a width of 4.5 mm, a length of 20.0 mm, and a thickness of 0.18 mm piece.

[0182]Using a viscoelasticity measuring device (DMA Q800 from TA instruments company), in tensile mode, with a frequency of 11 Hz and a heating rate of 3 °C / min, the tan δ (loss elastic modulus and storage modulus of elasticity). In this temperature range, the temperature at which tan δ showed the maximum value was read, and this was made the glass transition temperature (Tg) after thermal curing of the film for protective film formation.

[0183]

[0184] The storage elastic modulus at 23°C of the measure...

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Abstract

The present invention provides a film for forming a protective film capable of forming a highly reliable protective film while suppressing warping of a wafer. The film for protective film formation of this invention has thermosetting property, the glass transition temperature after thermosetting is 150-300 degreeC, and the tensile elastic modulus at 23 degreeC after thermosetting is 0.5-10 GPa.

Description

technical field [0001] The present invention relates to a film for forming a protective film, which can form a protective film on a semiconductor wafer or a semiconductor chip, and can improve the manufacturing efficiency of the semiconductor chip. In particular, it relates to a film for forming a protective film used in the manufacture of a semiconductor chip structured in a so-called face down mode. Background technique [0002] In recent years, semiconductor devices have been manufactured using a so-called face-down packaging method. In the face-down mode, a semiconductor chip having electrodes such as bumps on a circuit surface (hereinafter, may be simply referred to as a “chip”) is used, and the electrodes are bonded to a substrate. Therefore, the surface (chip back surface) opposite to the circuit surface of the chip is exposed. [0003] The exposed chip backside may be protected by an organic film. Conventionally, a chip having a protective film composed of such an...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/29C08J5/18C08L63/00H01L21/301H01L23/31
CPCC08J5/18C08L63/00H01L23/29H01L23/31H01L23/295C08J2333/08C08J2463/02C08J2463/04C08J2463/10B32B27/06B32B2457/14H01L2924/0002H01L2924/00C08K3/013
Inventor 佐伯尚哉山本大辅高野健
Owner LINTEC CORP
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