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Manufacturing process of blind buried resistor

A technology of manufacturing process and buried resistors, which is applied in the manufacture of multilayer circuits, including printed resistors, printed electrical components, etc., can solve problems such as instability and poor impedance matching, and achieve stable performance, good impedance matching, The effect of reducing production costs

Inactive Publication Date: 2018-05-01
丁保美
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the resistors account for a large proportion of components, this kind of separate resistors adds a lot of trouble to the process of mounting and plugging in the downstream process of the PCB board. At the same time, because it is connected to the circuit board by welding, etc., There are many problems such as poor impedance matching and instability

Method used

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  • Manufacturing process of blind buried resistor
  • Manufacturing process of blind buried resistor

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Embodiment Construction

[0028] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.

[0029] refer to figure 1 as shown, figure 1 It is a flowchart of an embodiment of the manufacturing process of the blind buried resistor provided by the present invention, and the process includes:

[0030] S101. Provide an insulating substrate.

[0031] Specifically, an insulating board can be provided, and the insulating board can be cut into the insulating substrate according to size requirements. It can be understood that, generally, glass brazing plates and the like can be used as insulating plates.

[0032] It should be...

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Abstract

The invention relates to a buried resistor manufacture process, comprising: providing an insulation substrate; forming an ink layer on the upper surface of the insulation substrate by using positioning reduction ink as materials; exposing and developing the ink layer according to a preset pattern to form a resistor pattern solidified on the upper surface of the insulation substrate; and forming a Ni-P alloy layer on the surface of the resistor pattern. The buried resistor manufactured according to the buried resistor manufacture process is integrated with the insulation substrate; compared with a traditional separate resistor, the processes of downstream mounting and socketing of a PCB can be omitted, thereby greatly shortening circuit board processes, improving production efficiency, and reducing production cost; meanwhile, the buried resistor has the characteristics of great impedance matchability, and stable performance.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a manufacturing process of blind buried resistors applied on circuit boards. Background technique [0002] Resistors are generally directly referred to as resistances in daily life. It is a current-limiting element. After the resistor is connected to the circuit, the resistance value of the resistor is fixed. Generally, there are two pins, which can limit the current through the branch it is connected to. According to the statistics of engineers and technicians in the electronic circuit industry, in the design of integrated circuits, resistance accounts for about 30% of the separated components. Since the resistors account for a large proportion of components, this kind of separate resistors adds a lot of trouble to the process of mounting and plugging in the downstream process of the PCB board. At the same time, because it is connected to the circuit board by welding, et...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/16H05K3/46
CPCH05K1/167H05K3/46
Inventor 丁保美贺建武
Owner 丁保美