The invention provides a design method of a multilayer HTCC
ceramic RF SIP
packaging tube shell and a packaging device, relates to the technical field of RF SIP packaging, and aims to comprehensively optimize packaging design from multiple targets of
signal integrity, heat dissipation performance,
mechanical reliability and the like by dynamically optimizing the number of
layers and the thickness of a multilayer stacked structure so as to avoid conflicts caused by single performance optimization. Meanwhile, based on the design of the gradient
microstrip line, the
impedance matching performance of
radio frequency signals is remarkably improved,
signal reflection and
transmission loss are reduced, and the antenna is suitable for high-frequency
signal transmission requirements.
Sensitivity analysis and correction factors are introduced through trial
assembly feedback, the deviation between
simulation modeling and actual performance is gradually reduced, and efficient and accurate multi-time updating optimization is achieved. The final
packaging tube shell design ensures excellent
signal integrity, heat dissipation capability and
structural reliability, and provides a systematic solution for modern high-frequency and miniaturized packaging.