Connector, connector assembly and device

Abstract

A connector is provided and includes a bottom, a top case positioned above the bottom case, and a partition is positioned between the top case and the bottom case. A plurality of ports is provided between the top case and the bottom case and the ports are separated by the partition. A temperature exchange device is mounted on the bottom case.

Description

technical field [0001] The present invention relates to a connector, an assembly including the connector, and a device including the connector assembly. Background technique [0002] The existing SFF (Small Form Factor) connectors are divided into male optical modules (male connectors) and female iron cages (female connectors). The male optical modules generate 1.0-4.0Watts of power during operation and fever. [0003] Due to the heat dissipation requirements of the public optical module, in the mainstream heat dissipation solutions, such as Figure 1 to Figure 4 As shown, in the illustrated prior art, on each port 1 of the SFF connector (the bottom housing 100, the top housing 200, the partition member 300, the radiator 400, the radiator clip 500 and the light pipe 600 See the location of Figure 1 to Figure 4 ) will provide a heat sink, the heat sink 400 installed on the opening 210 of the top case 200. When the male optical module (not shown) is inserted into port 1 of ...

AI Technical Summary

Problems solved by technology

[0008] a2) There is a narrow space on the top shell where the radiator with the lowest height can be installed, but at the same time, a light guide pipe must be installed in this part of the space, and the light guide pipe is similar in height to the radiator with the lowest height, which will block the flow to The airflow of the radiator fins makes the radiator unable to perform convective heat transfer. Analysis shows that in this case, the performance of the radiator will be reduced by more than 21%.

[0009] For the above-mentioned cases a1 and a2, it is impossible to effectively dissipate heat by arranging a heat sink on the top case. However, in the prior art, there is no other effective heat dissipation path except for a heat sink on the top case, thus Leading to the failure of the connector or the customer's cooling design of the whole machine

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