Multi-layer lamination ultrasonic transducer and manufacturing method thereof

Abstract

The invention provides a multi-layer ultrasonic transducer and a manufacturing method thereof. The multi-layer lamination ultrasonic transducer comprises a piezoelectric wafer assembly, and the piezoelectric wafer assembly comprises multiple piezoelectric wafers which are mutually bonded; the surface of each piezoelectric wafer is provided with multiple fractures, and the fractures divide an electrode layer of the corresponding piezoelectric wafer into multiple electrodes; the polarity of the electrodes of the bonding faces of the piezoelectric wafers which are mutually bonded is same; one side of the piezoelectric wafer assembly is bonded with at least one acoustic matching layer, the other side of the piezoelectric wafer assembly is bonded with at least one backing layer, the acoustic matching layer closest to the piezoelectric wafer assembly comprises a conducting area, or the backing layer closest to the piezoelectric wafer assembly comprises a conducting area. According to the multi-layer lamination ultrasonic transducer and the manufacturing method thereof, impedance of the piezoelectric wafers can be effectively reduced, and the problem of piezoelectric wafer vibration inhibiting caused by introduction of an additional coupling layer or a flexible circuit board can be solved.

Description

technical field [0001] The present invention relates to multilayer ultrasonic transducers and methods of manufacturing the same, and more particularly to multilayer ultrasonic transducers with improved vibration characteristics and methods of manufacturing the same. Background technique [0002] A transducer is a device that converts electrical signals into mechanical signals. For example, sensors in speakers can convert electrical signals into mechanical vibrations to generate sound waves. The same sensors are often used to generate high-frequency ultrasonic waves for use, such as medical imaging, non-destructive testing, etc. [0003] Ultrasound transducers used for medical imaging are composed of many components, and the distance between components is getting smaller and smaller with the continuous improvement of user requirements. With the reduction of the size of the components in the ultrasonic transducer, the electrical impedance mismatch between the ultrasonic tran...

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Problems solved by technology

[0007] However, the above-mentioned multilayer ultrasonic transducer has the disadvantage of poor vibration characteristics due to the addition of a flexible circuit board or other coupling layers between the piezoelectric wafer and the acoustic matching layer.

For example, some patents form flexible circuit boards on th...

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