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A kind of aluminum silicon carbide ceramic substrate for LED

A technology of aluminum silicon carbide and ceramic substrates, applied in the field of aluminum silicon carbide ceramic substrates for LEDs, can solve the problems of high-power LED LED luminous efficiency attenuation, life span impact, etc. Effect

Active Publication Date: 2016-12-07
江苏卓远半导体有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] As the demand for LED lighting becomes more and more urgent, the heat dissipation problem of high-power LEDs has been paid more and more attention (too high temperature will lead to the attenuation of LED luminous efficiency); fatal impact

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] An aluminum silicon carbide ceramic substrate for LED is made of the following components and parts by weight thereof:

[0023] 80 parts of aluminum silicon carbide; 7 parts of aluminum nitride; 7 parts of alumina micropowder; 7 parts of MCM-41 molecular sieve; 7 parts of glass sintering aid; 1 part plastic; 1 part dispersant; 1 part binder;

[0024] The weight composition of the glass sintering aid is 70 parts of silicon oxide; 10 parts of boron oxide; 10 parts of beryllium oxide; 10 parts of calcium oxide; 5 parts of aluminum oxide; 3 parts of phosphorus pentoxide; 3 parts of lithium oxide; share;

[0025] The rare earth oxide is Y with a particle size of less than 1 μm 2 o 3 ;

[0026] Described organic solvent is acetone, isopropanol binary mixed organic solvent system;

[0027] The dispersant is a PEG dispersant;

[0028] Described binder is PVB binder;

[0029] The particle size of the copper nanoparticles is 10 nm.

[0030] The preparation method of coppe...

Embodiment 2

[0037] An aluminum silicon carbide ceramic substrate for LED, made of the following components and parts by weight: 85 parts of aluminum silicon carbide; 8 parts of aluminum nitride; 8 parts of alumina micropowder; 8 parts of MCM-41 molecular sieve; glass sintering aid 9 parts; 6 parts of copper nanoparticles; 4 parts of rare earth oxide; 8 parts of organic solvent; 2 parts of plasticizer; 2 parts of dispersant; 2 parts of binder;

[0038] The weight composition of the glass sintering aid is 70 parts of silicon oxide; 10 parts of boron oxide; 10 parts of beryllium oxide; 10 parts of calcium oxide; 5 parts of aluminum oxide; 3 parts of phosphorus pentoxide; 3 parts of lithium oxide; share;

[0039] The rare earth oxide is La with a particle size of less than 1 μm 2 o 3 ;

[0040] Described organic solvent is acetone, isopropanol binary mixed organic solvent system;

[0041] The dispersant is a PEG dispersant;

[0042] Described binder is PVB binder;

[0043] The particle ...

Embodiment 3

[0051] An aluminum silicon carbide ceramic substrate for LED, made of the following components and parts by weight: 77 parts of aluminum silicon carbide; 6 parts of aluminum nitride; 6 parts of alumina micropowder; 6 parts of MCM-41 molecular sieve; glass sintering aid 6 parts; 6 parts of copper nanoparticles; 4 parts of rare earth oxide; 8 parts of organic solvent; 1 part of plasticizer; 1 part of dispersant; 1 part of binder;

[0052] The weight composition of the glass sintering aid is 70 parts of silicon oxide; 10 parts of boron oxide; 10 parts of beryllium oxide; 10 parts of calcium oxide; 5 parts of aluminum oxide; 3 parts of phosphorus pentoxide; 3 parts of lithium oxide; share;

[0053] The rare earth oxide is Yb with a particle size of less than 1 μm 2 o 3 ;

[0054] Described organic solvent is acetone, isopropanol binary mixed organic solvent system;

[0055] The dispersant is a PEG dispersant;

[0056] Described binder is PVB binder;

[0057] The particle siz...

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PUM

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Abstract

The invention discloses an aluminum-silicon carbide ceramic substrate for an LED. Various raw materials used in an LTCC preparation process are optimized. Aluminum-silicon carbide and aluminum nitride are used as main raw materials. Meanwhile, additives such as alumina micro powder, MCM-41 molecular sieves, glass sintering aids, copper nanoparticles, rare earth oxides, solvents, plasticizers, dispersing agents and binders are added, so that the physical and chemical properties of the ceramic substrate are further optimized. The thermal conductivity of the ceramic substrate is larger than 1000 W / (m*k), the bending strength of the ceramic substrate is larger than 500 Mpa, and the dielectric constant of the ceramic substrate is smaller than 3. Meanwhile, the main raw materials and the additives can be made into the ceramic substrate with the high thermal conductivity through a conventional LTCC preparation method, the preparation process is simple, and industrialization is facilitated.

Description

technical field [0001] The invention belongs to the field of substrates for LEDs, in particular to an aluminum silicon carbide ceramic substrate for LEDs. Background technique [0002] As the fourth-generation lighting source, light-emitting diodes (LEDs) are valued by countries all over the world for their advantages such as low maintenance costs, long life, good shock resistance, low power consumption, and environmental friendliness. They are widely used in indicator lights, display screens, Backlighting, landscape lighting, transportation, etc., the market potential is huge. [0003] As the demand for LED lighting becomes more and more urgent, the heat dissipation problem of high-power LEDs has been paid more and more attention (too high temperature will lead to the attenuation of LED luminous efficiency); Fatal impact. At present, there are four kinds of ceramic heat dissipation substrates that are more common: direct copper clad ceramic board (DBC), direct copper clad...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C29/02C22C1/05
Inventor 张新峰陈茂志梁赫
Owner 江苏卓远半导体有限公司
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