Supercharge Your Innovation With Domain-Expert AI Agents!

Packaging film, display device and packaging method of display device

An encapsulation film and encapsulation film technology, which is applied in the manufacture of semiconductor devices, electric solid-state devices, and semiconductor/solid-state devices, etc., can solve problems such as poor device quality, and achieve the effects of improving surface hydrophobicity, increasing density, and improving quality.

Active Publication Date: 2015-11-11
WUHAN TIANMA MICRO ELECTRONICS CO LTD +1
View PDF5 Cites 22 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of this, an embodiment of the present invention provides a packaging film, a display device and a packaging method thereof, so as to solve the technical problem of poor device quality caused by packaging OLED panels with organic polymer films in the prior art

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Packaging film, display device and packaging method of display device
  • Packaging film, display device and packaging method of display device
  • Packaging film, display device and packaging method of display device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0029] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention. In addition, it should be noted that, for the convenience of description, only parts related to the present invention are shown in the drawings but not all content.

[0030] In the process of manufacturing the display device, the display device needs to be packaged with an encapsulation film to prevent the display device from being corroded and oxidized by air and water vapor, which will damage the quality of the display device.

[0031] Figure 1a It is a schematic diagram of the structure of the existing inorganic encapsulation thin film, Figure 1b Schematic diagram of the components of the inorganic encapsulation film. combine Figure 1a and Figure 1b , the existing inorganic encapsu...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a packaging film, a display device and a packaging method of the display device. The packaging film includes a substrate, a flat layer formed on the substrate, and an adhesive layer formed on the flat layer; a bipolar packaging film is attached onto the adhesive layer; the bipolar packaging film comprises a bipolar porous material mixed in an organic resin material; and the bipolar porous material is a porous material with one bipolar organic material layer absorbed on the surface of the porous material. According to the technical scheme of the invention, the bipolar packaging film has a strong gas barrier capability, and therefore, the quality of the display device can be improved.

Description

technical field [0001] The invention relates to the technical field of display device manufacturing, in particular to a packaging film, a display device and a packaging method thereof. Background technique [0002] At present, an organic light-emitting diode (Organic Light-Emitting Diode, OLED) display panel is mainly encapsulated by an organic polymer film. Existing OLED substrates are packaged with epoxy resin films. Specifically, in the process of encapsulating the OLED, the OLED is basically coated with an epoxy resin monomer material, which is annealed and cured to form an epoxy resin film. [0003] Due to the weak gas barrier capability of the organic polymer encapsulation film, existing OLED substrates have the problem of pixel black spots or pixel shrinkage, resulting in poor quality of OLED substrates. That is, the existing encapsulation films using organic polymers lead to poor quality of OLED display panels. Contents of the invention [0004] In view of this,...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L51/56H01L51/52H01L27/32
CPCH10K50/846H10K50/844H10K71/00
Inventor 谢再锋李华敏汪涛
Owner WUHAN TIANMA MICRO ELECTRONICS CO LTD
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com