A sheet-by-sheet transfer device suitable for rolling flexible electronic devices

Abstract

The invention discloses a sheet-by-sheet transfer apparatus suitable for a rolling flexible electronic device. The sheet-by-sheet transfer apparatus comprises a film feeding unit, a carrier tape conveying unit, a vacuum roller adsorption unit, a pressure roller transfer unit and a waste material rejection unit, wherein the film feeding unit is used for feeding motion of a film and performing mold cutting on the film, the film after the mold cutting is driven via the vacuum roller adsorption unit to the pressure roller transfer unit, the film after the mold cutting realizes adhesion and fixation to a carrier tape in the pressure roller transfer unit, and the waste material rejection unit provides multiple real-time detection and rejection operation of a waste material according to condition needs. According to the invention, module units are connected with one another and cooperate together, a high-speed detection transfer process of the rolling flexible electronic device sheet by sheet is realized, and at the same time, the apparatus also has the advantages of good motion stability and reliability and the like.

Description

technical field [0001] The invention belongs to the field of equipment related to flexible electronics manufacturing, and more specifically relates to a sheet-by-sheet transfer device suitable for rolling flexible electronic devices. Background technique [0002] With the rapid development of the information industry, the application of electronic products is becoming more and more extensive, and its demand is also increasing day by day. Electronic components are the smallest unit of electronic products and the basis of electronic product applications. With the development of modern technology, electronic equipment products are becoming more and more complex, and the types and quantities of electronic components used are increasing explosively. However, any tiny component damage will lead to the scrapping of the circuit board or even the entire electronic product. In order to ensure the reliability of electronic components, research on the detection and transfer of electron...

AI Technical Summary

Problems solved by technology

In practical application, it is found that the current testing equipment is complex in structure and expensive, and most domestic electronic component manufacturing enterprises are still in labor-intensive production mode, and the testing in each process in the product manufacturing process usually uses manual testing. This method has high labor intensity, high cost, high false detection rate and low detection efficiency, which seriously affects production efficiency

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