Anisotropic conductive adhesive attaching stage device and anisotropic conductive adhesive attaching method
Patent Information
- Authority / Receiving Office
- CN Β· China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- BOE TECH GRP CO LTD
- Publication Date
- 2018-07-20
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Abstract
Description
technical field
[0001] The invention relates to an anisotropic conductive adhesive attaching stage device and an anisotropic conductive adhesive attaching method, belonging to the technical field of liquid crystal manufacturing. Background technique
[0002] At present, Rework (heavy industry) FPC (flexible circuit board, flexible circuit board) is to attach anisotropic conductive film (Anisotropic Conductive Film, referred to as ACF) on the FPC on the vacuum stage, and then attach the FPC with ACF Bonding (bonding) crimping with the Panel (LCD panel), the ACF attaching machine used is a semi-automatic machine, and the alignment is performed manually, and the FPC is aligned to the Mark (mark) position with human eyes. Sometimes it is necessary to speed up the operation Speed, it is easy to deviate from the Mark position, the alignment accuracy is poor, it is easy to cause alignment deviation, and it takes a long time. If the FPC with ACF and NG is not checked during Bonding...