A compound pulse laser deep hole processing device based on Bessel beam

A Bessel beam and composite pulse technology, applied in the field of composite pulse laser deep hole processing devices, can solve the problems of low positioning accuracy and low efficiency of composite pulse laser processing, and achieve stable transmission, high-efficiency processing, and improved The effect of machining accuracy

Active Publication Date: 2021-04-20
JIANGSU UNIV
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Problems solved by technology

[0004] In order to solve the problems of high depth-to-diameter ratio gas film hole processing taper, low efficiency and low positioning accuracy of composite pulse laser processing in the construction of aero-engines, the present invention provides a composite pulse laser deep hole processing method based on Bessel beams and device

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  • A compound pulse laser deep hole processing device based on Bessel beam
  • A compound pulse laser deep hole processing device based on Bessel beam
  • A compound pulse laser deep hole processing device based on Bessel beam

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Embodiment Construction

[0027] Such as figure 2 As shown, it includes: step S1 of compound pulse laser step-by-step processing, short pulse laser energy output, to realize the preliminary processing of microholes; step S2 ultrashort pulse energy output, to realize the material removal of micropore recasting layer and heat-affected area generated by S1 .

[0028] In the figure, the function of the first thin film on the upper surface of the double-sided coated plane mirror is to enhance the reflectivity of the 1064nm wavelength laser and reduce the transmittance of the 1062nm wavelength laser; the function of the second thin film on the lower surface is to enhance the transmittance of the 532nm wavelength laser , Reduce the reflectivity of 532nm wavelength laser.

[0029] The principle of double-sided coated flat mirror: the film that enhances the transmitted light is called an anti-reflection film, and the film that enhances the reflected light is called an anti-reflection film. Its principle is t...

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Abstract

The invention discloses a compound pulse laser deep hole processing device based on Bessel beams, which comprises a short / ultrashort pulse laser light source, a double-sided coated plane mirror, a small hole aperture, a frequency doubling crystal, a collimating mirror, a 1 / 4 Wave plate, Gauss-Bessel conversion device, scanning galvanometer; step-by-step processing of micro-holes using compound pulse laser: firstly use the advantages of high processing efficiency of short-pulse laser for preliminary processing of micro-holes, and then process according to ultra-short pulse laser The advantages of high precision and small heat-affected zone are to remove the recast layer and heat-affected zone for the above-mentioned primary processing micro-holes. Utilize the properties of Bessel beam spot with small diameter and long focal depth to process microholes with high aspect ratio; use double-sided coated plane mirror and small aperture diaphragm to carry out coaxial beam assembly, and unify the wavelength of composite laser through frequency doubling device, The transmission stability of the compound pulse laser in the same optical system is guaranteed, and the processing accuracy of the compound pulse laser is improved.

Description

technical field [0001] The invention belongs to the field of laser processing, in particular to a compound pulse laser deep hole processing device based on Bessel beams. Background technique [0002] Micropore manufacturing has important applications in aerospace, microfluidic devices, electronic components and other related fields. With the rapid development of science and technology, traditional processing methods can no longer meet the requirements of micropore processing, especially for aeroengines. Processing of tiny holes with large depth-to-diameter ratios on components. Laser microhole processing has been applied in various microhole processing due to its advantages of non-contact and the ability to process almost any material. Laser microhole processing technology can be mainly divided into three types according to the pulse width: long pulse laser processing, short pulse laser processing, etc. Pulse laser processing and ultrashort pulse laser laser processing. Am...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/382B23K26/0622
CPCB23K26/0622B23K26/0624B23K26/382
Inventor 任乃飞辛志铎任云鹏林卿陆恒
Owner JIANGSU UNIV
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