A compound pulse laser deep hole processing device based on Bessel beam

A Bessel beam and composite pulse technology, applied in the field of composite pulse laser deep hole processing devices, can solve the problems of low positioning accuracy and low efficiency of composite pulse laser processing, and achieve stable transmission, high-efficiency processing, and improved The effect of machining accuracy
CN110640338BActive Publication Date: 2021-04-20JIANGSU UNIV
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
JIANGSU UNIV
Publication Date
2021-04-20

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Abstract

The invention discloses a compound pulse laser deep hole processing device based on Bessel beams, which comprises a short / ultrashort pulse laser light source, a double-sided coated plane mirror, a small hole aperture, a frequency doubling crystal, a collimating mirror, a 1 / 4 Wave plate, Gauss-Bessel conversion device, scanning galvanometer; step-by-step processing of micro-holes using compound pulse laser: firstly use the advantages of high processing efficiency of short-pulse laser for preliminary processing of micro-holes, and then process according to ultra-short pulse laser The advantages of high precision and small heat-affected zone are to remove the recast layer and heat-affected zone for the above-mentioned primary processing micro-holes. Utilize the properties of Bessel beam spot with small diameter and long focal depth to process microholes with high aspect ratio; use double-sided coated plane mirror and small aperture diaphragm to carry out coaxial beam assembly, and unify the wavelength of composite laser through frequency doubling device, The transmission stability of the compound pulse laser in the same optical system is guaranteed, and the processing accuracy of the compound pulse laser is improved.
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Description

technical field

[0001] The invention belongs to the field of laser processing, in particular to a compound pulse laser deep hole processing device based on Bessel beams. Background technique

[0002] Micropore manufacturing has important applications in aerospace, microfluidic devices, electronic components and other related fields. With the rapid development of science and technology, traditional processing methods can no longer meet the requirements of micropore processing, especially for aeroengines. Processing of tiny holes with large depth-to-diameter ratios on components. Laser microhole processing has been applied in various microhole processing due to its advantages of non-contact and the ability to process almost any material. Laser microhole processing technology can be mainly divided into three types according to the pulse width: long pulse laser processing, short pulse laser processing, etc. Pulse laser processing and ultrashort pulse laser laser processing. Am...

Claims

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