Modularly-design multi-functional heating table mechanism

A modular design, multi-functional technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problem of not clearly and completely expressing the general process and ideas of modular design, having little reference value, and not considering modular design. problems such as connecting elements, to achieve the effects of facilitating standardized management, improving machining accuracy, and strong interactivity and interchangeability

Active Publication Date: 2015-11-25
SHANGHAI WEISONG IND AUTOMATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] (1) There is no abstract overview of the device's functions at a deep level, so that the function abstraction is separated from the concrete implementation;
[0005] (2) There is no clear and complete description of the general process and thinking of modular design, and there is little reference value;
[0006] (3) The problem of connection elements in the modular design is not considered, and the modification mechanism or replacement mechanism of a certain mechanism of the equipment is regarded as the whole of the modular design in a narrow sense.

Method used

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  • Modularly-design multi-functional heating table mechanism
  • Modularly-design multi-functional heating table mechanism
  • Modularly-design multi-functional heating table mechanism

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] A multi-functional hot stage mechanism with modular design, its structure is as follows figure 1 As shown, the hot stage mechanism is set up sequentially from bottom to top:

[0045] Motion abutment 1, its structure is as figure 2 and image 3 As shown: it includes a fixed bottom plate 11, a θ-axis sliding table 12 arranged on the fixed bottom plate 11 and rotating in the θ direction around the z-axis, and a first loading platform 13 arranged on the θ-axis sliding table 12 sequentially from bottom to top , the second carrying platform 15 moving along the y-axis and the third carrying platform 18 moving along the x-axis, the first carrying platform 13 is provided with a first guide rail 161 along the x-axis direction, and a first L-shaped connecting block 171, The first micrometer knob 141 is arranged on the first L-shaped connecting block 171, the second loading platform 15 is arranged on the first guide rail 161 and is connected with the first micrometer knob 141, a...

Embodiment 2

[0052] A multi-functional heating stage mechanism with modular design, the heating stage mechanism is set up sequentially from bottom to top:

[0053] Motion abutment 1, its structure is as figure 2 and image 3 As shown: it includes a fixed bottom plate 11, a θ-axis sliding table 12 arranged on the fixed bottom plate 11 and rotating in the θ direction around the z-axis, and a first loading platform 13 arranged on the θ-axis sliding table 12 sequentially from bottom to top , the second carrying platform 15 moving along the y-axis and the third carrying platform 18 moving along the x-axis, the first carrying platform 13 is provided with a first guide rail 161 along the x-axis direction, and a first L-shaped connecting block 171, The first micrometer knob 141 is arranged on the first L-shaped connecting block 171, the second loading platform 15 is arranged on the first guide rail 161 and is connected with the first micrometer knob 141, and the second loading platform 15 is pro...

Embodiment 3

[0057] A multi-functional heating stage mechanism with modular design, the heating stage mechanism is set up sequentially from bottom to top:

[0058] Motion abutment 1, its structure is as figure 2 and image 3 As shown: it includes a fixed bottom plate 11, a θ-axis sliding table 12 arranged on the fixed bottom plate 11 and rotating in the θ direction around the z-axis, and a first loading platform 13 arranged on the θ-axis sliding table 12 sequentially from bottom to top , the second carrying platform 15 moving along the y-axis and the third carrying platform 18 moving along the x-axis, the first carrying platform 13 is provided with a first guide rail 161 along the x-axis direction, and a first L-shaped connecting block 171, The first micrometer knob 141 is arranged on the first L-shaped connecting block 171, the second loading platform 15 is arranged on the first guide rail 161 and is connected with the first micrometer knob 141, and the second loading platform 15 is pro...

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PUM

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Abstract

The invention relates to a modularly-designed multi-functional heating table mechanism which comprises a movement base table (1) and a jig (4), wherein the jig (4) is arranged on the movement base table (1), a workpiece matched with the jig (4) is placed on the jig (4), the movement base table (1) comprises a fixed bottom plate (11), a Theta-axis sliding table (12), a first carrying platform (13), a second carrying platform (15) and a third carrying platform (18), the Theta-axis sliding table (12) is arranged on the fixed bottom plate (11) and does Theta-direction rotation movement around a Z-axis, the first carrying platform (13), the second carrying platform (15) moving along a y-axis and the third carrying platform (18) moving along an x-axis are sequentially arranged on the Theta-axis sliding table (12) from bottom to top, during working, the Theta-axis sliding table (12), the second carrying platform (15) and the third carrying platform (18) are respectively adjusted, the jig (4) is moved onto an appointed station, and the workpiece on the jig is processed. Compared with the prior art, the modularly-designed multi-functional heating table mechanism has the advantages of multiple functions, high processing accuracy, low manufacturing cost and the like.

Description

technical field [0001] The invention relates to the field of high-end packaging equipment for semiconductors, in particular to a multifunctional heating stage mechanism with a modular design. Background technique [0002] The concept of modular design originated in the 1960s. Under the background of the rapid development of science and technology in the past 30 years, the theory of modular design has been continuously improved. With the rapid development of the national economy, the mechanical equipment in the basic manufacturing industry is developing towards the trend of small batch, multi-function and high precision. This changing trend leads to the fact that traditional design methods and concepts cannot meet the needs of modern enterprises for fast, efficient and economical products. Modular design is an effective method to save cost, improve efficiency and shorten production cycle, and the application of this design method will be more and more. Such as the aircraft ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/56
CPCH01L21/56
Inventor 刘劲松张金志谢旭波
Owner SHANGHAI WEISONG IND AUTOMATION
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