LED (Light-Emitting Diode) packaging device with inverted structure and manufacturing method thereof

Abstract

The invention provides an LED (Light-Emitting Diode) packaging device with an inverted structure and a manufacturing method thereof used for solving the problem that the reliability of a chip is reduced when scaling powders are close to each other during flip chip bonding. The LED packaging device adopts the following scheme: LED chips are fixed on two electrode welding positions of a transfer substrate through the scaling powders, wherein the electrode welding positions are of groove structures, and the surfaces of the grooves are provided with electrode leads. The manufacturing method of the device comprises the following steps: manufacturing semi-solid fluorescent screens; inverting the LED chips on a supporting body and leaving a gap between the LED chips; pressing the semi-solid fluorescent screens on the supporting body which is provided with the LED chips, making the fluorescent screens covered at the peripheries of the LED chips, and then completely solidifying the fluorescent screens; producing the transfer substrate, and producing a groove on the electrode welding position of each LED chip of the transfer substrate; injecting the scaling powders into the grooves; and welding the LED chips on the transfer substrate in an inverting way. The LED packaging device with the inverted structure and the manufacturing method thereof provided by the invention can improve the reliability of the device and increase the yield of device packaging.

Description

technical field [0001] The invention relates to a red light LED packaging device. Background technique [0002] LED flip-chip technology is mostly used in high-power packaging devices, and it is widely used. see Figure 10 , the electrode 15 of the LED chip 13 is flip-chip mounted on the transfer substrate 16 through the flux 14 . There are many design schemes for the electrodes of the LED chip. In some schemes, the two electrodes are relatively close to each other. When the chip is flipped, the solder flux 14 may be connected together and the chip is short-circuited upside down. Even if the fluxes of the two electrodes are not connected, they will make the conductive spacing between the electrodes closer, forming a substantial capacitance, and leakage between electrodes may occur, or even breakdown. The use of flux is a fixed amount, but on the transfer substrate, when the chip is pressed on the transfer substrate, the flow direction of the flux is uncontrollable, which m...

AI Technical Summary

Problems solved by technology

[0003] In order to overcome the deficiencies of the prior art, the technical problem to be solved by the present invention is to provide an LED packaging device with a flip-chip structure and its manufacturing method, which is used to solve the problem of solder flux between two electrodes on the chip in the prior art. During flip-chip soldering, the problem of reduced chip reliability caused by flux close to each other

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