Camera module base, camera module and electronic device

Abstract

The invention provides a camera module base, a camera module and an electronic device. The base comprises a package base with open bottom and a barrel which is arranged on the package base. A first accommodating space which is communicated with the bottom opening is arranged in the package base. The hollow part in the barrel is communicated with the first accommodating space. The cross sectional area of the hollow part in the barrel is smaller than the cross sectional area of the first accommodating space in the package base. A clamping part which is used for clamping a filter in a second accommodating space from the edge is arranged on the inner wall of the barrel. The hollow part in the barrel is divided into two parts by the clamping part, wherein a part close to the first accommodating space is the second accommodating space. According to the invention, the filter is placed in the free space at the bottom of a lens; the thickness and the volume of the camera module base, the camera module and the electronic device are reduced; the cost of the filter is saved; and the imaging effect of the camera module is not affected.

Description

technical field [0001] The invention relates to electronic device imaging technology, in particular to a camera module base, a camera module and electronic equipment. Background technique [0002] Existing technology one [0003] The assembly structure of the existing camera module base and each component is as follows: figure 1 , figure 2 As shown, the base 1 is composed of a package seat 11 at the bottom and a lens barrel 12 at the top. The inside of the lens barrel 12 is mainly used to accommodate the lens 2, and the inside of the package seat 11 is mainly used to accommodate the optical filter 3 and the photosensitive chip 4. Finally, the flexible circuit board 5 is connected to the bottom of the package base 11, and the optical filter 3 and the photosensitive chip 4 are packaged in the package base 11. The optical filter 3 is attached to the inside of the package base 11, and is located between the lens 2 and the photosensitive chip. 4; the internal cross-sectional ...

AI Technical Summary

Problems solved by technology

[0005] In order to save costs, avoid a lot of waste of optical filters, and reduce the thickness of the camera module, some companies directly attach the optical filter 3 to the lens 2. During the focusing process, the debris produced by the resin layer will fall on the surface of the sensor chip and be directly imaged, resulting in a large number of stains on the image; if the filter 3 is attached by CSP (Chip Scale Package) technology, it will directly affect the lens. resolution, leading to a decrease in imaging quality; therefore, as far as the current technology is concerned, it is difficult to achieve

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