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Method for making anti-cracking plastic frame circuit

A production method and circuit technology, applied in the direction of coating, etc., can solve the problems that affect the service life of the product and cannot meet the requirements, and achieve the effects of improving thermal shock resistance, optimizing structure, and reducing local gaps

Active Publication Date: 2017-12-05
上海志承新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With this design, local gaps are prone to appear at the junction of the thin film circuit and the edge of the plastic frame, and salt spray and water vapor can easily enter through the gap, causing the thin film circuit to conduct electricity, which will not only seriously affect the service life of the product, but also make the product unable to meet the repeated heating requirements. Shock, salt spray and other harsh environment requirements

Method used

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  • Method for making anti-cracking plastic frame circuit
  • Method for making anti-cracking plastic frame circuit
  • Method for making anti-cracking plastic frame circuit

Examples

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Embodiment Construction

[0027] In order to make the technical means, creative features, objectives and effects of the present invention easy to understand, the present invention will be further elaborated below in conjunction with specific illustrations.

[0028] refer to figure 1 , figure 2 , image 3 , the manufacturing method of anti-cracking plastic frame circuit, step 1, adopts screen printing of nano-scale silver paste ink on the film to form a film circuit; the edge of the film part is concave, and the concave part of the film edge constitutes the embedded part, and the other parts Constituting the limiting part 5, the height of the limiting part 5 is equal to the height of the mold cavity of the injection mold, and the height of the embedded part is smaller than the height of the mold cavity of the injection mold; step 2, standing the film circuit in the mold cavity of the injection mold, The lower edge of the limiting part 5 is against the bottom of the mold cavity; step 3, injecting molt...

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Abstract

The invention discloses an anti-cracking plastic frame circuit manufacturing method, and relates to the technical field of circuit printing. The anti-cracking plastic frame circuit manufacturing method comprises the following steps: (1) nano-scale silver paste ink is printed on a film by a silk screen to form a film circuit; part edge of the film is inwards recessed; the inwards recessed part of the edge of the film forms an embedded part; the other part forms a limiting part; the limiting part is as high as a molding cavity of an injection mold; and the embedded part is lower than the molding cavity of the injection mold; (2) the film circuit is set up in the molding cavity of the injection mold; and the lower edge of the limiting part is butted against the bottom of the molding cavity; and (3) molten plastic is injected into the mold to manufacture an integrated injection part. Film and plastic bonding processes are once finished in the injection mold; and the film circuit and the main plastic part are firmly combined as a whole body, so that the effects of no falloff, no oxidization and no escape of solvent micromolecules are achieved. The anti-cracking plastic frame circuit manufacturing method optimizes the structure of the film circuit, and greatly improves the heat shock resistance and the salt fog resistance of products.

Description

technical field [0001] The invention relates to the technical field of circuit printing, in particular to a method for manufacturing a plastic frame circuit. Background technique [0002] In order to facilitate injection molding processing, the plastic frame circuits currently used in the electronics industry mostly use thin film circuits that are as high as the plastic frame and are glued to the plastic frame. With this design, local gaps are prone to appear at the junction of the thin film circuit and the edge of the plastic frame, and salt spray and water vapor can easily enter through the gap, causing the thin film circuit to conduct electricity, which will not only seriously affect the service life of the product, but also make the product unable to meet the repeated heating requirements. Shock, salt spray and other harsh environment requirements. Contents of the invention [0003] The object of the present invention is to provide a method for manufacturing an anti-c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C45/14B29C45/26B29C45/17
CPCB29C45/1418B29C45/26B29C2045/14245
Inventor 张国庆
Owner 上海志承新材料有限公司
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