43results about How to "Avoid circuit breaker problems" patented technology

The invention discloses a power supply device. The power supply device comprises a cuboid cover and a power supply unit arranged on the inner sides of the cover, supports are arranged on the two opposite inner side walls of the cover respectively, the middles of the supports are attached to the inner walls of the cover, the two ends of the supports are bent inwards to form U-shaped structures, and the power supply unit is clamped on the inner sides of the U-shaped structures of the two supports; baffles are arranged on the lower end faces of the two sides of the power supply unit, a rotating shaft is arranged between the baffles, the two ends of the rotating shaft are rotationally connected to the baffles respectively, supporting strips are arranged on the inner sides of the supports, and the rotating shaft is attached to the supporting strips and relatively rotates. According to the power supply device, as the cover structure is adopted, the power supply unit is centrally installed on the inner sides of the cover, and a power source can be conveniently inserted and connected; meanwhile, as the supports provided with vibration-reducing mechanisms are adopted, the vibration resistance of the overall structure can be improved, and better stability can be achieved.

A parallel array-type small refrigerator and a production thereof are provided. The refrigerator is a technic for enhancing temperature control on a laser device and a computer CPU, improving heat sink in a chip, thereby increasing a work efficiency of the chip, prolonging a life time, a layer structure and position array of the refrigerator are: a silicon substrate (6) of P-type semiconductors, a buffer layer (7) of the P-type semiconductors, a first adulteration layer (8) of the P-type semiconductors, a superlattice layer (9) of the P-type semiconductors, a second adulteration layer (10) of the P-type semiconductors, a light adulteration layer (11) of the P-type semiconductors, and a metal layer (13) in order; a silicon dioxide isolation layer (12) is positioned between the P-type semiconductors and between the metal layer and the first adulteration layer of the P-type semiconductors. A production process uses an oxide isolation process to form the parallel array-type small refrigerator, thus, a yield of device manufacturing is increased, and a contact area is reduced at the same time, thereby an interface contact resistance is largely reduced, refrigeration efficiency is largely increased.

The invention discloses an Internet of Things router. The Internet-of-things router comprises an Internet-of-things router body, Router mounting base, Arc-shaped protective cover, Telescopic connecting rod, First clamping buckle, Second clamping buckle, a third clamping buckle and a fourth clamping buckle, the Internet of Things router body is mounted on the upper surface of the router mounting base; a buffer pad is arranged between the bottom of the Internet of Things router body and the router mounting base; According to the invention, the arc-shaped protective cover and the protective net are additionally arranged on a traditional router; the waterproof and dustproof effects are provided for the waterproof and dustproof effects; meanwhile, the protective net is installed on the upper surface of the Internet of Things router body, stubborn dust accumulation can be prevented from influencing the heat dissipation function of the router, damage to the router due to too high temperatureis avoided, meanwhile, outdoor installation is achieved, and baffles at the bottoms of the two sides of the arc-shaped protective cover can guide rainwater to prevent the router from being splashed wet to cause the problem of open circuit.

The invention provides a touch panel. The touch panel comprises a first shielding layer arranged on one region on the surface of a substrate, a second shielding layer arranged on the first shielding layer and provided with a communication hole, an induction electrode layer arranged on the other region on the surface of the substrate, further arranged between the first shielding layer and the second shielding layer in an extending mode and partially exposed through the communication hole, and a conductive filling layer arranged in the communication hole and electrically connected with the induction electrode layer. The invention further provides a manufacturing method of the touch panel. Thus, the short circuit condition is prevented from occurring when the induction electrode layer on the touch panel extends to the shielding layers and the yield of the touch panel is effectively increased.

The invention discloses an anti-cracking plastic frame circuit manufacturing method, and relates to the technical field of circuit printing. The anti-cracking plastic frame circuit manufacturing method comprises the following steps: (1) nano-scale silver paste ink is printed on a film by a silk screen to form a film circuit; part edge of the film is inwards recessed; the inwards recessed part of the edge of the film forms an embedded part; the other part forms a limiting part; the limiting part is as high as a molding cavity of an injection mold; and the embedded part is lower than the molding cavity of the injection mold; (2) the film circuit is set up in the molding cavity of the injection mold; and the lower edge of the limiting part is butted against the bottom of the molding cavity; and (3) molten plastic is injected into the mold to manufacture an integrated injection part. Film and plastic bonding processes are once finished in the injection mold; and the film circuit and the main plastic part are firmly combined as a whole body, so that the effects of no falloff, no oxidization and no escape of solvent micromolecules are achieved. The anti-cracking plastic frame circuit manufacturing method optimizes the structure of the film circuit, and greatly improves the heat shock resistance and the salt fog resistance of products.

The invention discloses a PCB type TVS diode package and a preparation process thereof, comprising a BT resin PCB board and an epoxy resin, wherein the outer surface of the BT resin PCB board is provided with a TVS tube, and the epoxy resin is arranged on the upper surface of the TVS tube. A BT resin (bismaleimide (BMI) and triazine-based resin) is use as a substrate for that PCB positive and negative sides of the package and the preparation proces of the PCB-type TVS diode, and an etching line is used as a conduction, the substrate replaces a metal frame, and then the process flow is taken asa solid crystal, a bonding line, a stamping die, a cutting, a testing, a braiding and a warehousing; BT resin has a very high adhesion to the external sealant (epoxy resin) when molding, It is much higher than the combination with the metal frame, so that the product has higher air tightness, meanwhile, the expansion coefficient is close when the metal frame is heated and expanded, and the internal stress is smaller, so as to avoid the breakage problem of the metal frame when the metal frame is welded at the client end, and the product has higher reliability and quality.

The invention discloses a method for packaging a cadmium zinc telluride pixel detector module. The method is used for solving the technical problem that according to an existing method for packaging the cadmium zinc telluride pixel detector module, the relative position accuracy of connecting adhesive points is poor. According to the technical scheme, a silver conductive adhesive is adopted as an inversion connecting medium, a three-dimensional automatic adhesive dispenser is utilized for accurately controlling the size and the relative position of the adhesive points in a matrix adhesive dispensing mode, an inversion welding instrument is also utilized for controlling accurate walking of a transmission system in a two-CCD framing and focusing working mode, the problem that pixel electrodes on a cadmium zinc telluride pixel electrode detector element are correspondingly connected with metal electrodes on a substrate in a one-to-one mode is solved, and the short-circuit or breaking phenomenon of the pixel electrodes is avoided. Due to the adoption of the program-controlled matrix adhesive dispensing mode, the relative position between the adhesive points is effectively controlled, the precision reaches 10 micrometers, meanwhile, due to the adoption of a flow controller, the size of the obtained minimum adhesive point is 150 micrometers, and the short-circuit problem of the pixel electrodes is effectively solved.

The invention relates to an electric cooker provided with a waterproofing interface and convenient for plug fixing. The electric cooker comprises a main body, a pot cover, an assisting mechanism, an inner cover, a protective mechanism, a control panel, a lifting handle, a base, a connecting structure, a liner, a clamping groove and a fixing mechanism, wherein the pot cover is arranged on the uppersurface of the main body; the assisting mechanism is arranged in the pot cover; the inner cover is inserted into the outer side, close to the pot cover, of the assisting mechanism, and the protectivemechanism is arranged on the body wall of the side, away from the pot cover, of the main body; and the control panel is embedded in the body wall of one side of the protective mechanism. According tothe electric cooker provided by the invention, the assisting mechanism, which can conduct assisting cleaning on the liner of the electric cooker, is arranged, and the assisting mechanism is driven byvirtue of a motor; after the liner is filled with cleaning liquid, the electric cooker is covered by the pot cover and an hairbrush extends and makes into contact with the liner by virtue of an electric telescopic rod, and the electric telescopic rod can be driven to rotate after the motor is started, so that the hairbrush and a supporting frame, under the action of the motor, are rotated, and the supporting frame can drive a cleaning block to wipe the body wall of the liner; and therefore, an effect of conducting automatic cleaning can be achieved.

Parallel array micro-cooler and its preparation method are a technology used to improve the temperature control of laser devices and computer CPUs, improve the heat dissipation inside the chip, thereby improving the working efficiency of the device chip and prolonging the service life. Its layered structure , and its positions are arranged in order: the silicon substrate (6) of the P-type semiconductor, the buffer layer (7) of the P-type semiconductor, the first heavily doped layer (8) of the P-type semiconductor, and the superlattice layer ( 9), the second heavily doped layer (10) of the P-type semiconductor, the third heavily doped layer (11) of the P-type semiconductor, and the metal layer (13); the silicon dioxide isolation layer (12) is located between the P-type semiconductor between the metal layer and the first heavily doped P-type semiconductor. The manufacturing process adopts the oxide isolation process to form a parallel array micro-cooler, which can improve the yield of device manufacturing and reduce the contact area, thereby greatly reducing the interface contact resistance and greatly improving the cooling efficiency.

The invention discloses a novel instrument insulation can. The insulation can comprises an inner casing and an outer glass casing, the inner casing is hung in the outer glass casing via connecting assemblies, a hollow interlayer is formed between the inner casing and the outer glass casing, the top wall of the inner casing is connected with the top wall of the outer glass casing via connecting assemblies, the bottom wall of the inner casing is connected with the bottom wall of the outer glass casing via connecting assemblies, each connecting assembly comprises a stud, a holddown spring and internal and external fastening nuts, the inner walls in the left and right sides of the inner casing are provided with conductors respectively, and the outer walls in the left and right sides of the outer casing are provided with induction coil discs at positions corresponding to the conductors respectively. Electromagnetic induction heating and the heat insulated hollow interlayer are used to greatly reduce heat loss of the insulation can, the heat insulating ability is improved, and a heating line is avoided for circuit break due to heat fatigue in both cold and hot environments simultaneously.

The invention discloses an Internet of Things router, comprising an Internet of Things router body, a router installation base, an arc-shaped protective cover, a telescopic connecting rod, a first snap-on buckle, a second snap-on buckle, a third snap-on buckle and a fourth snap-on buckle , the Internet of Things router body is installed on the upper surface of the router installation base, and a buffer pad is provided between the bottom of the Internet of Things router body and the router installation base. Waterproof and dustproof. At the same time, the protective net is installed on the upper surface of the Internet of Things router body, which can prevent the accumulation of stubborn dust and affect its heat dissipation function, and avoid the damage of the router due to excessive temperature. At the same time, it can be installed outdoors and has arc protection. The baffles at the bottom of both sides of the cover can guide rainwater to prevent the router from splashing and causing disconnection problems.

The invention discloses an anti-cracking plastic frame circuit manufacturing method, and relates to the technical field of circuit printing. The anti-cracking plastic frame circuit manufacturing method comprises the following steps: (1) nano-scale silver paste ink is printed on a film by a silk screen to form a film circuit; part edge of the film is inwards recessed; the inwards recessed part of the edge of the film forms an embedded part; the other part forms a limiting part; the limiting part is as high as a molding cavity of an injection mold; and the embedded part is lower than the molding cavity of the injection mold; (2) the film circuit is set up in the molding cavity of the injection mold; and the lower edge of the limiting part is butted against the bottom of the molding cavity; and (3) molten plastic is injected into the mold to manufacture an integrated injection part. Film and plastic bonding processes are once finished in the injection mold; and the film circuit and the main plastic part are firmly combined as a whole body, so that the effects of no falloff, no oxidization and no escape of solvent micromolecules are achieved. The anti-cracking plastic frame circuit manufacturing method optimizes the structure of the film circuit, and greatly improves the heat shock resistance and the salt fog resistance of products.

The invention discloses a primary battery replacement adapter cooperatively used with a rechargeable battery and an application method thereof. The primary battery replacement adapter comprises a battery shell cylinder and a matched conductor accommodated in the battery shell cylinder, wherein a first conducting terminal and a second conducting terminal are arranged at two ends of the shell cylinder respectively and are electrically connected with each other through the matched conductor. When the adapter is used, the proper primary battery replacement adapter and rechargeable battery are selected according to the structure of a battery chamber of electrical equipment and are arranged at a battery installation position of the battery chamber respectively, wherein the anode and the cathodeof the rechargeable battery are placed according to the correct direction so that the rechargeable battery powers the equipment. Compared with the conventional battery using scheme, the primary battery replacement adapter has the advantages of convenient use, saved cost, resource protection, low carbon and environmental friendliness.

A light-emitting diode packaging structure, including a substrate, a first electrode and a second electrode located on opposite sides of the substrate, a light-emitting diode fixed on the upper surface of the first electrode, and electrically connected to the light-emitting diode and the first electrode . The lead wire of the second electrode also includes a reflective cup fixed on the outer end surface of the first electrode and the second electrode away from the substrate, the reflective cup is arranged around the first electrode and the second electrode, and the first electrode and the entire upper surface and lower surface of the second electrode are exposed to the reflective cup. In the present invention, because the upper surfaces of the first electrode and the second electrode are completely exposed to the reflector cup, in this way, in the process of solid crystal and wire bonding, the active area of ​​the first electrode and the second electrode, the light emitting diode and the wire Large, so as to avoid the problem of circuit disconnection caused by difficult fixation and wire offset caused by the small active area, and improve the stability of the light emitting diode packaging structure.

Embodiments of the present invention provide an OLED substrate and its preparation method, and an OLED display device, which relate to the field of display technology and can solve the problem of disconnection caused by the breakage of the second electrode layer at the junction between the side of the pixel defining layer located in the opening area and the first surface Or the problem of poor conductivity uniformity. The OLED substrate includes: a plurality of first electrodes arranged on the bottom plate; a pixel defining layer including a plurality of opening regions, each of which exposes one of the first electrodes; a light emitting layer arranged in the opening regions a second electrode layer disposed on the light-emitting layer and covering the pixel defining layer; an auxiliary electrode extending from the side of the pixel defining layer located in the opening region to the first surface, and connected to the pixel defining layer The second electrode layer is in contact; the first surface is the surface of the pixel defining layer away from the bottom plate.

The invention provides a touch panel. The touch panel comprises a first shielding layer arranged on one region on the surface of a substrate, a second shielding layer arranged on the first shielding layer and provided with a communication hole, an induction electrode layer arranged on the other region on the surface of the substrate, further arranged between the first shielding layer and the second shielding layer in an extending mode and partially exposed through the communication hole, and a conductive filling layer arranged in the communication hole and electrically connected with the induction electrode layer. The invention further provides a manufacturing method of the touch panel. Thus, the short circuit condition is prevented from occurring when the induction electrode layer on the touch panel extends to the shielding layers and the yield of the touch panel is effectively increased.