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Light-emitting diode packaging structure

A technology of light-emitting diodes and packaging structures, which is applied in the direction of electrical components, electric solid devices, circuits, etc. It can solve problems such as wire offset, difficult crystal bonding, and circuit breakage, and achieve the effect of increasing the active area and improving stability.

Active Publication Date: 2018-05-15
ZHANJING TECH SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if the area for die bonding and wire bonding is too small, it is easy to cause difficulty in die bonding or offset wire bonding, resulting in circuit breakage.

Method used

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  • Light-emitting diode packaging structure
  • Light-emitting diode packaging structure
  • Light-emitting diode packaging structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0012] see figure 1 and figure 2 The light emitting diode packaging structure 100 according to the first embodiment of the present invention includes a substrate 10 , a first electrode 20 and a second electrode 30 located on opposite sides of the substrate 10 , a light emitting diode 40 fixed on the upper surface of the first electrode 20 , A reflective cup 50 fixed on the outer end surfaces of the first electrode 20 and the second electrode 30 and a packaging body 60 filled in the reflective cup 50 .

[0013] The substrate 10 is made of insulating material, and its longitudinal section is in an inverted T shape with a small top and a large bottom, so that two steps 11 are formed on opposite sides thereof. The substrate 10 is used to electrically isolate the first electrode 20 and the second electrode 30 .

[0014] The longitudinal section of the first electrode 20 is rectangular, and its upper end protrudes outward near an inner end surface of the substrate 10 to form a fi...

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Abstract

A light-emitting diode packaging structure, including a substrate, a first electrode and a second electrode located on opposite sides of the substrate, a light-emitting diode fixed on the upper surface of the first electrode, and electrically connected to the light-emitting diode and the first electrode . The lead wire of the second electrode also includes a reflective cup fixed on the outer end surface of the first electrode and the second electrode away from the substrate, the reflective cup is arranged around the first electrode and the second electrode, and the first electrode and the entire upper surface and lower surface of the second electrode are exposed to the reflective cup. In the present invention, because the upper surfaces of the first electrode and the second electrode are completely exposed to the reflector cup, in this way, in the process of solid crystal and wire bonding, the active area of ​​the first electrode and the second electrode, the light emitting diode and the wire Large, so as to avoid the problem of circuit disconnection caused by difficult fixation and wire offset caused by the small active area, and improve the stability of the light emitting diode packaging structure.

Description

technical field [0001] The invention relates to a semiconductor element, in particular to a light emitting diode packaging structure. Background technique [0002] A traditional light emitting diode packaging structure includes a substrate, a first electrode and a second electrode arranged on the upper surface of the substrate and electrically isolated from each other, a light emitting diode fixed on the first electrode, and electrically connected to the first electrode by wire bonding. , a plurality of wires of the second electrode and the light-emitting diode, and a reflective cup arranged on the first electrode and the second electrode and surrounding the light-emitting diode. The bottom surface of the reflector cup is fixed on the upper surface of the first electrode and the second electrode and extends from the edge of the first electrode and the second electrode to the area where the light emitting diode is located, thereby covering most of the first electrode and the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/60H01L33/52H01L33/62H01L33/64
CPCH01L33/62H01L33/486H01L33/54H01L33/60H01L2224/48257H01L2224/48247H01L2224/48091H01L2924/00014
Inventor 林厚德叶辅湘张超雄陈滨全陈隆欣
Owner ZHANJING TECH SHENZHEN
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