A PCB type TVS diode package and a preparation process thereof

Abstract

The invention discloses a PCB type TVS diode package and a preparation process thereof, comprising a BT resin PCB board and an epoxy resin, wherein the outer surface of the BT resin PCB board is provided with a TVS tube, and the epoxy resin is arranged on the upper surface of the TVS tube. A BT resin (bismaleimide (BMI) and triazine-based resin) is use as a substrate for that PCB positive and negative sides of the package and the preparation proces of the PCB-type TVS diode, and an etching line is used as a conduction, the substrate replaces a metal frame, and then the process flow is taken asa solid crystal, a bonding line, a stamping die, a cutting, a testing, a braiding and a warehousing; BT resin has a very high adhesion to the external sealant (epoxy resin) when molding, It is much higher than the combination with the metal frame, so that the product has higher air tightness, meanwhile, the expansion coefficient is close when the metal frame is heated and expanded, and the internal stress is smaller, so as to avoid the breakage problem of the metal frame when the metal frame is welded at the client end, and the product has higher reliability and quality.

Description

technical field [0001] The invention relates to the technical field of TVS diode packaging, in particular to a PCB type TVS diode packaging and a preparation process thereof. Background technique [0002] Transient voltage suppressor diode, referred to as TVS diode, is a high-efficiency protection device in the form of a diode. When the two poles of the TVS diode are impacted by reverse transient high energy, it can The magnitude of square seconds) makes its impedance drop suddenly, and at the same time absorbs a large current, clamping the voltage between its two ends at a predetermined value, so as to ensure that the subsequent circuit components are not damaged by the impact of transient high energy. At present, the packaging of conventional TVS diodes belongs to semiconductor packaging. In the production process, its production process is: die bonding, welding, compression molding, T / F (trimming / bending) molding, baking, testing, tape, and storage ; The specific steps a...

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Problems solved by technology

[0003] The purpose of the present invention is to provide a PCB-type TVS diode package and its preparation process to solve the current process limitations proposed in the above background technology. The number of single chips is small, the UPH is very low during production, and a large amount of production equipment needs to be invested to increase production capacity. ;At the same time, the thermal expansion coefficients of metal and epoxy rubber cakes are different. When welding and using on the market, it is prone to cracking and penetration. At the same time, there is also the problem of internal stress expansion and breaking of welding wires.

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