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Circuit board blind hole depth test structure and test method thereof

A technology of depth testing and testing methods, which is applied in electric/magnetic depth measurement, electromagnetic measurement devices, etc., can solve the problems of inability to obtain test results immediately on site, unfavorable long-term development of enterprises, limited number of slices, etc., and achieve convenient and fast testing. , Improve production efficiency and save the effect of slicing materials

Inactive Publication Date: 2015-12-02
VICTORY GIANT TECH HUIZHOU CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, in the process of testing the depth of blind holes in circuit boards, circuit board manufacturers have very high requirements for the precision of the production machine, and the quality of production is difficult to control. Microscopic measurement is used to determine the depth of blind holes. This method of blind hole detection is not only complicated in the production process, time-consuming, and high in cost, but also has a limited number of slices, monitoring the blind area, and cannot immediately obtain test results on site. Sending to the physical laboratory for analysis, the interval is long, which is not conducive to on-site operation, resulting in low production efficiency, which is not conducive to the long-term development of the enterprise

Method used

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  • Circuit board blind hole depth test structure and test method thereof
  • Circuit board blind hole depth test structure and test method thereof
  • Circuit board blind hole depth test structure and test method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Embodiment 1 A kind of blind hole depth testing structure of two-layer circuit board

[0023] A circuit board blind hole depth test structure includes a circuit board body 1 to be drilled with blind holes formed by laminating three layers of circuit boards 11 . The three-layer circuit boards are provided with a line area 111 and an edge area 112 at the same position, and the line area and the edge area overlap after the three-layer circuit boards are laminated. The line area is the connecting circuit of the line, and the edge area is the area that needs to be removed during the edge process of the line. In the edge area 112 of each layer of circuit board, a depth test area 1121 for testing the circuit board to be drilled with blind holes is provided, and two groups of test points are arranged on the depth test area 1121 of each layer of circuit board 1122. The first group of test points indicates the connection status of the circuit board on the second layer, and the s...

Embodiment 2

[0024] Embodiment 2 A kind of testing method of blind hole depth of two-layer circuit board

[0025] A method for testing the depth of a blind hole on a circuit board, comprising the following specific steps:

[0026] S1. Select the three-layer circuit board body 1 made in Example 1 for testing.

[0027] S2. Place the circuit board body 1 on the platform of the drilling machine to drill holes. When drilling, the blind hole drilling knife and the test point drilling knife in the drilling machine move downward synchronously, and the depth of the downward movement is the same, so that the depth of the blind hole on the drilling knife and the test point on the circuit board body is the same as that of the test point. same depth. The drilling machine drills the blind holes in the circuit body and the two sets of test points on the circuit board. After drilling, clean the circuit board body to facilitate the next operation. The drilling machine can be drilled with a mechanical d...

Embodiment 3

[0034] Embodiment 3 A structure for testing the depth of blind holes in an N-layer circuit board

[0035]A circuit board blind hole depth test structure includes a circuit board body 1 formed by laminating N-layer circuit boards 11 to be drilled with blind holes. The line area 111 and the edge area 112 are provided at the same position of the N-layer circuit boards, and the line area and the edge area overlap after the N-layer circuit boards are laminated. The line area is the connecting circuit of the line, and the edge area is the area that needs to be removed during the edge process of the line. In the edge area 112 of each layer of circuit boards, a depth test area 1121 for testing circuit boards to be drilled with blind holes is provided, and N-1 groups are arranged on the depth test area 1121 of each layer of circuit boards. Test point 1122, the first group of test points indicates the connectivity of the second layer of circuit boards, the second group of test points i...

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Abstract

The invention discloses a circuit board blind hole depth test structure comprising a circuit board body formed by press-fitting N layers of circuit boards. Each of the N layers of circuit boards is provided with a circuit area and an edge milling area. The edge milling area of each layer of circuit board is provided with a depth test area. The depth test area of each layer of circuit board is provided with (N-1) groups of test points, wherein the test points arranged in the first layer of circuit board and the test points arranged in the last layer of circuit board are not communicated, and each layer of circuit board from the second layer of circuit board to the (N-1)th layer of circuit board is communicated with the test points corresponding to the layer of circuit board. The invention further discloses a circuit board blind hole depth test method. The traditional test method is changed, the test structure is optimized, and the test structure is simple and highly practical. Blind hole depth test is more accurate, the test speed and efficiency are improved, the time for circuit board blind hole depth test is shortened, and the efficiency of circuit board manufacturing is improved. The manufacturing cost and the consumption of slice materials are reduced, and the cost of production is reduced.

Description

technical field [0001] The invention belongs to the field of circuit board production, and in particular relates to a circuit board blind hole depth test structure and a test method thereof. Background technique [0002] With the continuous development of circuit board technology, circuit board technology has also been rapidly improved, and is widely used in communication, computer and other technical fields. At the same time, in order to realize partial communication between circuit boards and meet special needs, it is necessary to make blind holes to meet their needs. The circuit board is made of blind holes by using a drilling machine to make blind holes. After the blind holes are made, the depth of the blind holes is tested to check whether it meets the needs of customers. At present, in the process of testing the depth of blind holes in circuit boards, circuit board manufacturers have very high requirements for the precision of the production machine, and the quality o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01B7/26
Inventor 黄慧李加余王忱
Owner VICTORY GIANT TECH HUIZHOU CO LTD
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