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Laser sampling methods for reducing thermal effects

A technology of thermal effect and laser ablation, applied in thermal excitation analysis, material excitation analysis, material analysis by optical means, etc., can solve problems such as unfavorable data quality, low sensitivity and separation

Inactive Publication Date: 2015-12-02
ELECTRO SCI IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Multiple pulse overlapping is causing progressive heating of the sample, which has been shown to be detrimental to data quality, i.e. a thermal mechanism for the erosion is causing melting of the sample and formation of large particles, which is responsible for low ICP-MS sensitivity and separation (fractionation); therefore the results do not represent the true composition of the sample

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  • Laser sampling methods for reducing thermal effects
  • Laser sampling methods for reducing thermal effects
  • Laser sampling methods for reducing thermal effects

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Embodiment Construction

[0030] The following description will generally refer to specific structural embodiments and methods. It will be appreciated that there is no intention to be limited to the expressly disclosed embodiments and methods, but that other features, components, methods and embodiments may also be used in the practice of this disclosure. The preferred embodiments are described to illustrate the disclosed technology, not to limit its scope, which is defined by the claims. Those of ordinary skill in the art will recognize various equivalent variations of the descriptions that follow. Unless otherwise stated, references in this application to relationships such as parallel, aligned, or in the same plane mean that the specified relationships are within process constraints and are within manufacturing variations. When elements are described as being coupled, connected, in contact or in contact with each other, they need not actually be in direct contact with each other unless explicitly s...

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Abstract

A method for reducing thermal effects in laser ablation optical emission spectrometry includes creating discrete ablation spots along an analysis line on a target surface. At least one of the following is also carried out. First, the ablation spots are positioned so that a pair of successive ablation spots are spaced apart from one another along the analysis line and are separated from one another by another ablation spot. Second, when the analysis line comprises generally parallel, adjacent analysis line segments, the ablation spots are positioned so that (A) a pair of successive ablation spots are on different analysis line segments, and (B) the successive ablation spots are positioned to be at different longitudinal positions along the analysis line segments when the different analysis line segments are adjacent to one another. As a result, a linear scan of isolated ablation spots can be generated.

Description

[0001] Related applications [0002] This application claims the benefit of US Provisional Patent Application Serial No. 61 / 791,502 filed March 15, 2013, the disclosure of which is incorporated by reference. Background technique [0003] Laser ablation inductively coupled plasma mass spectrometry (LA-ICP-MS) or laser ablation inductively coupled plasma optical emission spectrometry (LA-ICP-OES) techniques can be used to analyze a target material (e.g., a solid or liquid target material). Typically, a sample of the target material in the form of an aerosol (ie solid and possibly liquid particles and / or vapor suspended in a carrier gas such as helium) is supplied to an analysis system. The sample is typically produced by arranging the target in a laser ablation chamber, introducing a flow of carrier gas into the chamber, and using one or more laser pulses to ablate a portion of the target to produce a (hereinafter referred to as "target material") ejected or otherwise generate...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N21/71G01N21/63
CPCH05H1/30G01N21/718H01J49/0463
Inventor 席亚朗·约翰·派崔克·欧康纳
Owner ELECTRO SCI IND INC