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Gantry type sapphire wafer double-sided grinding/polishing machine and grinding and polishing method

A sapphire wafer, double-sided grinding technology, applied in the field of polishing machines, can solve the problems of difficult grinding and polishing of sapphire wafers, left and right shaking of the cantilever structure, and high hardness of sapphire, achieves both stability and aesthetics, optimizes the polishing process, and improves stability. sexual effect

Inactive Publication Date: 2018-06-22
HARBIN UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Sapphire has high hardness and high brittleness. It is very difficult to grind and polish the surface of the sapphire wafer on both sides. Currently, the cantilever type is used in the actual production and processing of sapphire wafer. Double-sided grinding and polishing machine, the equipment has a complex structure and is difficult to maintain. During the grinding and polishing process, due to the relative movement between the upper and lower grinding discs, it is easy to cause the cantilever structure to shake left and right

Method used

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  • Gantry type sapphire wafer double-sided grinding/polishing machine and grinding and polishing method
  • Gantry type sapphire wafer double-sided grinding/polishing machine and grinding and polishing method
  • Gantry type sapphire wafer double-sided grinding/polishing machine and grinding and polishing method

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Embodiment 1

[0033] A double-sided grinding / polishing machine for gantry-type sapphire wafers, comprising: a box body and a bottom plate system 5, a power transmission system 4 is installed inside the box body and the bottom plate system, and the upper plane of the box body and the bottom plate system A lifting support system 1 is installed, and a hydraulic system 6 is installed on the top of the lifting support system. The front end of the hydraulic system is connected to the grinding bearing 7 through a connecting shaft, and an upper grinding system 2 is installed below the grinding bearing. The power transmission system is connected with motor A38, motor B30, motor C29, motor D37 by transmission belt respectively.

Embodiment 2

[0035] According to the gantry type sapphire wafer double-sided grinding / polishing machine described in embodiment 1, there is an upper grinding disc 8 above the upper grinding system, the lower grinding system 3 is below the upper grinding system, and the motor A38 passes through The transmission belt is connected with the deceleration helical gear 39, the deceleration helical gear meshes with the lower helical gear 22 and the upper helical gear 19 respectively, the described lower helical gear meshes with the direction changing helical gear 21, and the described direction changing helical gear meshes with the main helical gear The transmission lower helical gear 20 meshes, the main transmission lower helical gear is connected with the main shaft 12, the grinding disc drive sleeve 13 is installed outside the main shaft, the upper helical gear meshes with the outer transmission helical gear 18, and the The outer transmission helical gear is connected with the outer transmission...

Embodiment 3

[0037] According to the gantry type sapphire wafer double-sided grinding / polishing machine described in embodiment 1, the motor B is connected with the external transmission spur gear 31 through a connecting shaft, and the external transmission spur gear meshes with the spur gear A32, and the The spur gear is connected with the outer seat 24 of the bearing seat, and the outer seat of the bearing seat is connected with the support seat 23 of the large ring gear, and the large ring gear 16 is installed above the support seat of the large ring gear.

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Abstract

The invention relates to a gantry type sapphire wafer double-face grinding / polishing machine and a grinding and polishing method. At present, a cantilever type double-face grinding polisher is adopted in the sapphire wafer producing and processing process and is complex in structure and hard to maintain, and in the grinding and polishing process, due to relative motion between an upper grinding disc and a lower grinding disc, a cantilever structure is prone to shake left and right. The gantry type sapphire wafer double-face grinding / polishing machine comprises a box and bottom plate system (5), a power transmission system (4) is mounted in the box and bottom plate system, a lifting supporting system (1) is mounted on the upper plane of the box and bottom plate system, a hydraulic system (6) is mounted at the top of the lifting supporting system, and the front end of the hydraulic system is connected with a grinding bearing (7) through a connecting shaft. An upper grinding system (2) is mounted below the grinding bearing, and the power transmission system is connected with a motor A (38), a motor B (30), a motor C (29) and a motor D (37) through driving belts.

Description

Technical field: [0001] The invention relates to the field of polishing machines, in particular to a gantry type sapphire wafer double-sided grinding / polishing machine and a grinding and polishing method. Background technique: [0002] Sapphire has high hardness and high brittleness. It is very difficult to grind and polish the surface of the sapphire wafer on both sides. At present, the cantilever type double-sided grinding and polishing machine is used in the actual production and processing of sapphire wafer. The structure of this equipment is complex and difficult to maintain. During the grinding and polishing process, due to the relative movement between the upper and lower grinding discs, it is easy to cause the cantilever structure to shake left and right. Especially when grinding high-hardness materials, it is necessary to apply a large processing load. This shaking is more obvious, and even the phenomenon of "overturning" of the upper grinding disc has occurred, cau...

Claims

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Application Information

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IPC IPC(8): B24B37/04B24B37/08B24B37/34B24B29/02B24B1/00B24B47/12
CPCB24B1/00B24B29/02B24B37/042B24B37/08B24B37/34B24B47/12
Inventor 徐雳董瑞吴石刘冰
Owner HARBIN UNIV OF SCI & TECH
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