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A kind of integrated sensor and preparation method thereof

A technology of integrating sensors and sensors, applied in the field of sensors, can solve the problems of narrowing the scope of use, the temperature and humidity integrated sensors do not have bendable deformation, etc., and achieve the effect of simple and compact structure

Active Publication Date: 2017-06-23
SOUTHEAST UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Existing integrated temperature and humidity sensors are generally made of rigid materials such as metal or silicon, resulting in integrated temperature and humidity sensors that do not have the characteristics of bending and deformation, thus greatly reducing their application range

Method used

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  • A kind of integrated sensor and preparation method thereof
  • A kind of integrated sensor and preparation method thereof
  • A kind of integrated sensor and preparation method thereof

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Experimental program
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Embodiment Construction

[0038] The technical solution of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0039] Such as figure 1 As shown, the embodiment of the present invention provides an integrated sensor, including a flexible substrate 1 , a lower metal electrode 2 , a graphene film 3 , a first metal electrode 4 , a second metal electrode 5 and a graphene oxide film 6 . The flexible substrate 1 is fixedly connected to the upper surface of the lower metal electrode 2 , and the flexible substrate 1 is provided with through holes. The graphene film 3 is located in the through hole of the flexible substrate 1 , and the graphene film 3 fills the through hole of the flexible substrate 1 . The first metal electrode 4 and the second metal electrode 5 are respectively connected to the upper surface of the flexible substrate 1, there is a gap between the first metal electrode 4 and the second metal electrode 5, and the graphene oxide film 6 is conn...

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Abstract

The invention discloses an integrated sensor, comprising a flexible substrate, a lower metal electrode, a graphene film, a first metal electrode, a second metal electrode and a graphene oxide film; the flexible substrate is fixedly connected to the upper surface of the lower metal electrode, and the flexible substrate is A through hole is provided; the graphene film is located in the through hole of the flexible substrate, and the graphene film is filled with the through hole of the flexible substrate; the first metal electrode and the second metal electrode are respectively connected to the upper surface of the flexible substrate, and the first metal electrode There is a gap between the first metal electrode and the second metal electrode, and the graphene oxide film is connected to the upper surface of the first metal electrode and the second metal electrode, and extends into the gap between the first metal electrode and the second metal electrode, and the graphene The upper surface of the film is attached. A method for preparing the flexible integrated sensor is also disclosed. The temperature and humidity sensor has the advantages of simple structure, convenient processing, high sensitivity, light weight, flexibility and good biocompatibility.

Description

technical field [0001] The invention relates to a sensor, in particular to an integrated sensor and a preparation method thereof. Background technique [0002] Since the temperature and humidity of the environment are closely related to people's actual life and industrial production, integrated temperature and humidity sensors have emerged in recent years. The integrated temperature and humidity sensor converts the temperature and humidity values ​​in the environment into electrical signals that are easy to measure through sensitive materials. Temperature and humidity sensors on the market generally measure temperature and relative humidity. Existing temperature and humidity integrated sensors are generally made of rigid materials such as metal or silicon, resulting in the temperature and humidity integrated sensor not having the characteristics of being bendable and deformable, thus greatly reducing its application range. Contents of the invention [0003] Technical pro...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N27/22G01K7/22
Inventor 聂萌章丹黄庆安
Owner SOUTHEAST UNIV
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