A Greedy Algorithm Based Heat Transfer Optimal Arrangement Method for Electronic Components

Abstract

A method for the heat transfer optimized arrangement of electronic elements based on a greedy algorithm comprises an element placement stage and an element adjustment stage. The method comprises: dividing a base plate into a plurality of square grids with the same size; using a base plate region as a computing domain; numerically solving the temperature distribution of the base plate region; analyzing the existing layout of electronic elements; placing electronic elements to be placed into the grid with the lowest temperature in an element-placeable region according to the temperature distribution; recording the order of placement, and then, proceeding to the element adjustment stage, which specifically comprises: taking out the electronic elements according to the order of placement, recalculating the temperature distribution of the base plate every time one electronic element is taken out, determining the element-placeable region, and placing the taken-out electronic elements into the grid with the lowest temperature, so as to obtain the optimal layout. The method has the advantages of simple optimization process, high optimization speed, outstanding performance indexes, high expansibility, great practicability, etc.

Description

technical field [0001] The invention relates to a method for optimizing the arrangement of electronic components, in particular to a method for optimizing the arrangement of heat transfer of electronic components based on a greedy algorithm. Background technique [0002] With the development of microelectronics technology, the volume of electronic devices is getting smaller and smaller, and the heat flux is getting bigger and bigger. The problem of heat dissipation has become one of the bottlenecks in the miniaturization of electronic devices. Electronic devices are made up of many large and small electronic components that continuously generate heat during operation. If the heat cannot be taken away in time, the overall temperature of the device will rise. Exceeding the temperature threshold will cause damage to the device, affect the normal operation of the instrument and equipment, and even cause a safety accident in severe cases. On the other hand, some components, inst...

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Problems solved by technology

However, the optimized distribution of high thermal conductivity materials is often complex. In practical engineering applications, it is very difficult to process the distribution of high thermal conductivity materials strictly according to the optimization results. Therefore, it is difficult to achieve the expected heat transfer effect by filling high thermal conductivity materials.

In addition, the filling and processing of high thermal conductivity materials also greatly increase the cost of electronic devices, which affects the economic benefits of devices in practical applications to a certain extent.

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