Semiconductor package element and method for manufacturing same

Abstract

The invention provides a semiconductor package element and a method for manufacturing the same. The same semiconductor package element comprises a substrate, at least one chip, an encapsulation layer and at least one grid part, wherein the at least one chip is arranged on the substrate, the encapsulation layer is arranged on the substrate and encapsulates the at least one chip, and the at least one grid part is arranged in the encapsulation layer and comprises a plurality of main body parts, wherein the main body parts are opened and limited by a first rib and a second rib.

Description

technical field [0001] Exemplary embodiments of the present invention relate to the field of semiconductor packaging, and in particular, to a semiconductor package and a method of manufacturing the semiconductor package. Background technique [0002] At present, in semiconductor packages, the coefficient of thermal expansion (Coefficient of Thermal Expansion, CTE) of each component in the semiconductor package is different, which will cause the semiconductor package to warp, which in turn affects the subsequent mounting process and cutting process of the substrate. . For example, when a semiconductor chip is encapsulated on a substrate with an encapsulation material such as epoxy resin, warping of the semiconductor package may occur due to thermal expansion and contraction of the encapsulation material. [0003] figure 1 is a schematic cross-sectional view showing warpage of a semiconductor package according to the prior art, figure 2 is another schematic cross-sectional...

AI Technical Summary

Problems solved by technology

At such a temperature, the substrate 101, the chip, and the encapsulation layer 103 having different thermal expansion coefficients are bonded to each other, so that when the temperature drops to room temperature, the shrinkage of the encapsulation layer 130 causes the substrate 110 to be recessed along the surface on which the chip is mounted. (see figure 1 ), or cause the substrate 110 to protrude along the surface on which the chip is mounted (see figure 2 ) in the direction of warpage

Images