Diode Microchip Filling Guide Mold and Filling Method
A diode and chip technology, which is applied in the field of diode production, can solve problems affecting the yield of diodes, chips falling on the end face of the glass bulb, and diodes without chips, etc., and achieve the effects of improving the filling yield, high practicability, and easy operation
Active Publication Date: 2017-10-31
JINAN JINGHENG ELECTRONICS
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Problems solved by technology
The above-mentioned chip sucker device is for loading chips in large quantities, although it solves the problem of manual loading efficiency, but for the attached figure 2 The diameter of the large end of the D-head lead is larger than the outer diameter of the glass bulb, but the diameter of the sintering mold hole is equal to the diameter of the big end of the D-head lead and is also larger than the outer diameter of the glass bulb. In this way, when filling, Due to the assembly error of the chip sucker and the sintering mold, a small number of chips will fall on the end face of the glass bulb or outside the glass bulb, resulting in the phenomenon of no chip in the diode, which affects the yield of the diode production
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[0021] The present invention will be further described and defined below in conjunction with the accompanying drawings and specific embodiments.
[0022] Such as figure 1 As shown, a microchip filling guide mold for a diode includes a mold substrate 1, a plurality of cylindrical bosses 2 located on the mold substrate 1, and a tapered hole 3 is opened in each cylindrical boss 2, and the tapered hole 3 It runs through the cylindrical boss 2 and the mold substrate 1 , and the axis of the tapered hole 3 coincides with the axis of the cylindrical boss 2 .
[0023] In this embodiment, the outer diameter of the cylindrical boss 2 is an interference fit with the inner diameter of the sintering mold hole 11. After assembly, the cylindrical boss 2 will sink into the sintering mold hole 11, and its end surface will be in contact with the end surface of the glass bulb 7. Contact; the diameter of the upper hole of the taper hole 3 is greater than the limit counterbore 9 diameter of the c...
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The invention discloses a filling guiding die and a filling method of a mini chip of a diode. The filling guiding die comprises a die substrate and multiple cylindrical bosses placed on the die substrate, each cylindrical boss is internally provided with a tapered hole, each tapered hole penetrates the corresponding cylindrical boss and the die substrate, and the axis of the tapered hole is overlapped with that of the corresponding cylindrical boss. The filling method comprises that the filling guiding die is cooperated with a sintering die and a chip sucker in use, and the mini chip falls onto a glass bulb accurately under guidance of the taped holes of the filling guiding die. The filling guiding die is highly practical and simple in operation, and compared with the prior art, the problem that the mini chip is not easy to enter the center of the glass bulb when the chip sucker is used is solved, and the filling yield of the diode is greatly improved.
Description
technical field [0001] The invention relates to a microchip filling guide mold for diodes, and also relates to a microchip filling method for diodes based on the mold, which belongs to the technical field of diode production. Background technique [0002] Round T-head lead diode is a diode with special structure, such as figure 2 As shown, it includes a glass bulb 7, a microchip 8 and two circular D-head leads 6, the glass bulb 8 is a circular glass tube, and the circular D-head lead 6 is a "T" shape, and the diameter of the big end of the D-head is larger than that of the glass tube. The outer diameter of the shell 7 and the diameter of the small end are smaller than the inner diameter of the glass shell 7 . Two circular D-head leads 6 are respectively inserted into the glass shell 7 from both ends and are in contact with the microchip 8 . [0003] The currently existing diode sintering mold adopts circular hole axial positioning for the diode filling process. The method i...
Claims
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IPC IPC(8): H01L21/67
CPCH01L21/67121
Inventor 王培祥邵亦军朱海涛石广兵王会峰李琳琳
Owner JINAN JINGHENG ELECTRONICS