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a printed circuit board

A technology for printed circuit boards and narrow boards, applied in the field of printed circuit board reinforcement, can solve the problems of narrow board frames being easily broken under force, and achieve the effects of preventing breakage, improving product quality, and increasing strength

Active Publication Date: 2017-11-07
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The embodiment of the present invention provides a printed circuit board to overcome the defect that the narrow board frame of the printed circuit board is easily broken under force

Method used

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  • a printed circuit board
  • a printed circuit board
  • a printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Figure 2A It is a schematic structural diagram of a printed circuit board provided in Embodiment 1 of the present invention; Figure 2B It is a structural schematic diagram of a printed circuit board with a reinforcing plate welded on the pad; Figure 2C is along Figure 2B The schematic diagram of the cross-sectional structure cut by the section line AA' of the middle printed circuit board. see Figure 2A , Figure 2B and Figure 2C , the printed circuit board includes: a first pad 20 , a second pad 21 , a first reinforcing plate 22 and a second reinforcing plate 23 . The first pad 20 is located in the area of ​​the narrow plate frame 24 on the surface of the printed circuit board and / or the corner connection area 26 between the narrow plate frame 24 and the surface of the main printed circuit board 25, and the surface of the first pad 20 is coated with solder paste 27 for use. For welding the first reinforcement plate 22; the second pad 21 is located on the sid...

Embodiment 2

[0037] On the basis of Example 1, in the implementation of this example, as image 3 As shown, the first pad 20 is located in the area of ​​the narrow frame 24 on the surface of the printed circuit board, and the second pad 20 is located in the side cross section 28 of the printed circuit board corresponding to the area of ​​the narrow frame 24 . The first pad 20 and the second pad 21 are respectively welded to the first reinforcing plate 22 and the second reinforcing plate 23 through solder paste 27 . The first reinforcing plate 22 and the second reinforcing plate 23 are integrally formed by one reinforcing plate, and the second reinforcing plate 23 is bent relative to the first reinforcing plate 22 . The coverage area ratio of the first reinforcing plate 22 and the first welding pad 20 is 1:1; the coverage area ratio of the second reinforcing plate 23 and the second welding pad 21 is 1:1.

[0038] Preferably, the first pad and the second pad are covered on the printed circu...

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PUM

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Abstract

The invention discloses a printed circuit board. The printed circuit board comprises a first bonding pad, a second bonding pad, a first reinforcement plate and a second reinforcement plate, wherein the first bonding pad is arranged on a narrow plate frame region on the surface of the printed circuit board and / or a corner connection region of the surfaces of a narrow plate frame and a printed circuit board main body, and the surface of the first bonding pad is coated with soldering tin paste for welding the first reinforcement plate; the second bonding pad is arranged on a side cross section, corresponding to the narrow plate frame, of the printed circuit board and / or a side cross section of the circuit board on a connection corner of the narrow plate frame and the printed circuit board main body, and the surface of the second bonding pad is coated with soldering tin paste for welding the second reinforcement plate; the first reinforcement plate is arranged above the first bonding pad and welded with the first bonding pad; and the second reinforcement plate is arranged above the second bonding pad and welded with the second bonding pad. With the technical scheme provided by the embodiment of the invention, the bonding pads are arranged on the surface of the narrow plate frame of the printed circuit board and the side cross section, the reinforcement plates are welded above the bonding pads, and thus, the broken resistant ability of the narrow plate frame region of the printed circuit board is improved.

Description

technical field [0001] Embodiments of the present invention relate to the technical field of printed circuit board reinforcement, and in particular to a printed circuit board. Background technique [0002] The rapid development of electronic products makes ultra-thin electronic products favored by the public. Usually, ultra-thin electronic products are achieved through thinner printed circuit boards and designing the internal circuit structure space of electronic products to be more compact and narrower. When the space structure of the printed circuit board is designed to be compact and narrow, the circuit board frame becomes narrow locally, forming an "L" shape, a "C" shape or other shapes with a narrow frame area of ​​the printed circuit board. Figure 1A and Figure 1B It is a structural schematic diagram of a narrow plate frame of a printed circuit board in the prior art, wherein, Figure 1A The narrow plate frame 10 of the middle printed circuit board is a regular rect...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02
CPCH05K1/0271
Inventor 陈鑫锋
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD