A Digital Capacitive Level Meter Based on TDC Chip Technology

A chip technology, capacitive technology, applied in the field of level meter, can solve problems such as data distortion, drift, and can not really meet the production needs of enterprises, achieve improved anti-interference ability, improved resolution, solve the problem of hanging materials and temperature The effect of floating problems

Active Publication Date: 2019-03-19
JIANGSU JACK INSTR
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There are data distortion and drift problems in these links.
[0005] Therefore, the existing technology cannot really meet the production needs of enterprises.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A Digital Capacitive Level Meter Based on TDC Chip Technology
  • A Digital Capacitive Level Meter Based on TDC Chip Technology
  • A Digital Capacitive Level Meter Based on TDC Chip Technology

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0035] Such as figure 1 , figure 2 , image 3 and Figure 4 A digital capacitive level gauge based on TDC chip technology is shown, including: a digital sensing unit 1, a microcontroller unit 2, a communication or output unit 3 and a mechanical structure, wherein the digital sensing unit 1 consists of capacitance measurement unit 4, TDC measurement unit 5, temperature measurement unit 6, data logic processor 7, sequential ALU unit 8, result and status register 9, control and mode register 10, microprocessor interface unit 11 and compensation circuit Composition, the capacitance measurement unit 4 is composed of an RLC measurement unit 41 and an RLC counter 42, and the mechanical structural parts are composed of a housing and structural parts.

[0036] The relationship between the above components is as follows:

[0037] The digital sensing unit 1, the microcontroller unit 2 and the communication or output unit 3 are all arranged in the mechanical structural parts, the str...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The present invention discloses a digitized capacitance-type level meter based on the TDC chip technology. The level meter comprises a digit sensing unit, a micro controller unit, a communication or output unit and a mechanical structural member, wherein the digit sensing unit, the micro controller unit and the communication or output unit are all disposed inside the mechanical structural member. According to the digitized capacitance-type level meter based on the TDC chip technology, by connecting a TDC measuring unit with a data logic processor, time intervals are measured in a high-precision manner through delay time for digital TDC application signals to pass an inner logic gate, a chip can precisely reconstruct a signal passing logic gate number through a simple circuit structure and a special circuit board wiring method, the highest precision depends on the maximum logic gate delay time of the chip, and in comparison with a conventional method for measuring capacitance by an artificial circuit, a resolution ratio is raised by more than 1000 orders of magnitudes and the anti-jamming capability is promoted by more than 10 times, thereby well solving problems such as strong radiated interference resistance, and well meeting requirements of clients.

Description

technical field [0001] The invention relates to the field of level gauges, in particular to a digital capacitive level gauge based on TDC chip technology. Background technique [0002] In the process of measuring the material level, to realize the online monitoring and control of the material level height, the key lies in whether the current material level height can be accurately detected. In recent years, many new types of material level detection methods have appeared, and various material level measuring instruments have also developed rapidly. At present, there are three main development directions for level measuring instruments: non-contact measurement, intelligentization, miniaturization and integration of level instruments. At the same time, with the development of science and technology, and the transplantation of the latest achievements in other related fields to level measurement, the level measuring instrument has been widely used in some special occasions (suc...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): G01F23/26
Inventor 陈林闵心怡巢利锋
Owner JIANGSU JACK INSTR
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap