Silicon-silicon bonding based micro mechanical accelerometer for reducing packaging stress
A technology of accelerometer and packaging stress, which is applied in the direction of measuring acceleration, velocity/acceleration/shock measurement, measuring devices, etc. It can solve problems such as not suitable for stress isolation, and achieve improved full-temperature drift performance, good stress distribution symmetry, outstanding effect
Inactive Publication Date: 2015-12-23
SUZHOU UNIV
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Problems solved by technology
[0007] (1) Choose a substrate material with low thermal mismatch, that is, choose a material with a thermal expansion coefficient close to that of silicon, such as Kovar alloy (KOVAR), aluminum nitride ceramics etc., but the cost of this approach is higher
[0008] (2) Use low-stress flexible adhesive materials such as soft silicone; the use of flexible adhesives has the disadvantage of weak bonding strength, and flexible adhesives Not suitable for applications with shear stress
The disadvantage is that the thermal stress is distributed in a gradient from large to small from the fixed end to the suspended end of the cantilever beam, which is not suitable for the stress isolation of the single fulcrum pendulum structure
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[0033] Such as image 3 Described, a kind of micromachined pendulum type accelerometer that reduces package stress based on silicon-silicon bonding, this structure is made up of chip layer 10, silicon substrate isolation layer 21 and LTCC shell 22, silicon substrate isolation layer 21 and LTCC The tube shells 22 are connected by an adhesive 23, and a strip-shaped bump 211 for silicon-silicon bonding with the chip layer 10, that is, a bonding area, is etched on the surface of the silicon substrate isolation layer 21, and the silicon substrate Other areas on the surface of the isolation layer 21 are non-bonding areas. The bump 211 can also be in other shapes, such as ellipse and so on.
[0034] A deep groove 212 is etched around the bump 211, the size of which is determined by the thermal stress isolation effect, the modal frequency of the structure and the impact resistance, and the bump 211 is aligned to the center of the accelerometer sensitive structure Fulcrum 11, etch...
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The invention discloses a silicon-silicon bonding based micro mechanical accelerometer for reducing packaging stress. The micro mechanical accelerometer comprises a chip layer, a silicon substrate isolation layer and a shell, wherein the silicon substrate isolation layer and the shell are connected through a bonding agent. The micro mechanical accelerometer is characterized in that the chip layer comprises a center fulcrum arranged at the center of an accelerometer sensitive structure, a projection for realizing silicon-silicon bonding with the chip layer is etched at the surface of the silicon substrate isolation layer, and the projection is aligned with the central portion of the center fulcrum. Such a structure reduces thermal stress to the minimum, effectively improves the full-temperature shift performance of the micro mechanical accelerometer and has a remarkable effect for a high-precision high-temperature MEMS sensor, thereby being widely applied to various occasions.
Description
technical field [0001] The invention relates to a capacitive micromechanical single fulcrum pendulum sensor, in particular to a micromechanical accelerometer based on silicon-silicon bonding that reduces package stress. Background technique [0002] As an important application field of MEMS technology, silicon micromachined accelerometers have been widely used in various fields of inertial measurement due to their advantages of low cost, small size, low power consumption, impact resistance, and high reliability. The capacitive silicon micromachined accelerometer has attracted widespread attention due to its excellent characteristics such as simple manufacturing process, good repeatability, and low temperature coefficient, and has become one of the most developed and widely used inertial devices. [0003] The fabrication methods of silicon micromachined capacitive accelerometers include surface micromachining and bulk silicon micromachining. The former is compatible with the...
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IPC IPC(8): G01P15/125
Inventor 郭述文周铭
Owner SUZHOU UNIV