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Workpiece polishing device

A technology for a grinding device and a workpiece is applied in the field of grinding devices for workpieces to achieve the effects of high flatness, simple and uniform formation, and difficulty in undulation or damage.

Active Publication Date: 2015-12-23
SHIN-ETSU HANDOTAI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The inventors of the present invention conducted research on this reason and found the following matters

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0069] The workpiece was polished using the workpiece polishing device of the present invention, and the flatness and damage defect rate of the polished workpiece were evaluated.

[0070] In Example 1 used figure 1 grinding device. The grinding head of the grinding device is as figure 2 As shown, in addition to templates, use the same Figure 8 The grinding head is the same as the grinding head. The template at this time is produced by the following method. First prepare bisphenol A type epoxy resin, which is added with a glass filler whose concentration has been adjusted to a maximum external dimension of 2mm, and then make an epoxy resin prepreg containing glass fibers, which is coated with a sprayer. A bisphenol A type epoxy resin was clothed, and this prepreg was laminated on the pressing surface side of the pressing abrasive cloth, and press-molded into a ring shape. The template had a thickness of 750 μm, and the surface occupancy of the filler exposed on the pres...

Embodiment 2

[0073] The workpiece was polished under the same conditions as in Example 1 except that the template was different from that described below, and the flatness and damage defect rate of the polished workpiece were evaluated. The template at this time is produced by the following method. A flat-woven glass fiber cloth with an aspect ratio of 0.5 mm and a thickness of 0.18 mm was impregnated with a bisphenol A epoxy resin, and dried to produce a prepreg for the surface. This prepreg was laminated on the pressing surface side of the pressing abrasive cloth, and press-molded into a ring shape with a thickness of 760 μm. Then, the pressing surface of the pressing polishing cloth was polished so that the glass fibers were exposed in a net shape. In this template, the surface occupancy of the glass fiber cloth exposed on the pressing surface of the pressing abrasive cloth was 16%.

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Abstract

The present invention is a workpiece polishing device comprising a polishing cloth for polishing a workpiece, a polish supply mechanism for supplying polish, and a polishing head for holding the workpiece; the polishing head holding the back surface of the workpiece by a backing pad and holding the edge part of the workpiece by an annular template, and pressing the workpiece and the template against the polishing cloth, whereby the workpiece is rubbed against the polishing cloth and the workpiece is polished, wherein the workpiece polishing device is characterized in that the template is composed of a resin to which a filler is added or a resin in which a woven cloth is included, and minuscule concavities are formed in the surface pressing against the polishing cloth by exposing the filler or the woven cloth on the surface. A workpiece polishing device is thereby provided in which the speed of polishing the outer periphery of the workpiece is stable and the workpiece can be polished with high flatness.

Description

technical field [0001] The invention relates to a workpiece grinding device. Background technique [0002] When manufacturing a semiconductor wafer such as a silicon wafer, one of the important steps is a polishing step for improving the surface roughness of the wafer and increasing the flatness. [0003] Along with the high precision of modules in recent years, semiconductor wafers used in the manufacture of modules are required to be planarized with very high precision. For such a requirement, chemical mechanical polishing (CMP; Chemical Mechanical Polishing) is used as a technique for planarizing the surface of a semiconductor wafer. [0004] As an apparatus for polishing the surface of a workpiece such as a silicon wafer, there are a single-side polishing apparatus that polishes one surface of the workpiece one by one and a double-side polishing apparatus that simultaneously polishes both surfaces. [0005] General single-side grinding devices such as Figure 7 As show...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/32H01L21/304
CPCB24B37/32H01L21/02024B24B37/20
Inventor 桥本浩昌佐佐木正直
Owner SHIN-ETSU HANDOTAI CO LTD
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