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Laser processing device

A laser processing and laser technology, used in metal processing equipment, laser welding equipment, manufacturing tools, etc., can solve the problems of deterioration of processing quality, long scanning time, halving of peak power, etc., so as to suppress the deterioration of processing quality and save space. Effect

Active Publication Date: 2020-03-10
MITSUBISHI ELECTRIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In this case, since the avoidance action of the galvanometric optical scanner usually takes a few milliseconds, there is a problem that the scanning time of the galvanometric optical scanner is longer, resulting in a longer processing time
[0008] Furthermore, in the laser processing device described in Patent Document 1, one laser beam is divided into two beams, so the peak power of the laser beam used for processing is halved relative to the peak power of the laser oscillator.
Therefore, there is a problem that it takes a long time to drill metal materials and glass materials that require processing with a large peak power, and the processing quality deteriorates due to the influence of heat.

Method used

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Experimental program
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Effect test

no. 1 Embodiment approach

[0030] figure 1 It is a schematic configuration diagram of the laser processing apparatus 1 according to the first embodiment of the present invention. The laser processing apparatus 1 performs laser drilling processing by irradiating the object 11 with laser light (pulse laser light). The object to be processed 11 is, for example, a printed circuit board built in a personal computer.

[0031] Laser processing device 1 has: laser oscillator 3a, 3b; polarization mechanism 4a, 4b; processing head 16; XY table (table) 12; laser power sensor (laser power sensor) 14; Section 20. The object 11 to be processed is placed on the XY table 12 .

[0032] The laser oscillator 3a is a first laser oscillation mechanism that outputs laser light 2a (first laser light). The laser oscillator 3b is a second laser oscillation mechanism that outputs laser light 2b (second laser light). The laser processing apparatus 1 can simultaneously perform drilling processing on two positions by irradiati...

no. 2 Embodiment approach

[0123] Image 6 It is a block diagram of the laser processing apparatus 41 which concerns on 2nd Embodiment of this invention. The laser processing device 41 according to the second embodiment has a plurality of processing heads. Since the laser processing device 41 has a plurality of processing heads, it is possible to realize high-speed laser processing. The same reference numerals are attached to the same parts as those in the first embodiment, and their descriptions are appropriately omitted.

[0124] The laser processing device 41 has: for example, two processing heads 16a (the first processing head, 16b (the second processing head); laser oscillators 3a, 3b; beam splitting adjustment mechanisms 42a, 42b; Mirror 45 ; polarization mechanisms 4 a , 4 b , 4 c , 4 d , XY table 12 ; laser power sensor 14 ; control unit 50 .

[0125]On the XY table 12, two objects to be processed 11a (first object to be processed) and 11b (second object to be processed) are placed. The lase...

no. 3 Embodiment approach

[0218] Figure 11 It is a block diagram of the laser processing apparatus 61 which concerns on 3rd Embodiment of this invention. The laser processing device 61 according to the third embodiment has a plurality of processing heads. Moreover, in the laser processing apparatus 61, the variation of the power loss between each optical path of laser beam 44a, 44b, 44c, 44d can be reduced. The same reference numerals are assigned to the same parts as those in the first and second embodiments, and description thereof will be omitted as appropriate.

[0219] The laser processing device 61 has: for example, two processing heads 16a, 16c; laser oscillators 3a, 3b; beam splitting adjustment mechanisms 42a, 42b; 4d; XY table; laser power sensor 14; control unit 50.

[0220] The polarizing beam splitter 43a reflects, for example, the S-polarized light of the incident laser light 2a, and transmits the P-polarized light. The polarizing beam splitter 43b reflects, for example, the S-polari...

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Abstract

The invention provides a laser processing device. In a laser processing process in which multi-point simultaneous irradiation is performed, high-quality laser processing can be performed in high speed in a space saving manner. The laser processing device (1) is provided with the components of a laser oscillator (3a) which is used as a first laser oscillating mechanism and outputs first laser; a laser oscillator (3b) which is used as a second laser oscillating mechanism and outputs second laser; an auxiliary galvanometer optical scanner (7a) which is used as a first auxiliary galvanometer type optical scanner; an auxiliary galvanometer optical scanner (7b) which is used as a second auxiliary galvanometer type optical scanner; a polarized light splitter (8) which is used as a laser combining mechanism; main galvanometer type optical scanners (9a,9b); a f-theta lens (10) which focuses the first laser and the second laser from the main galvanometer type optical scanners; and a laser oscillator control part (22) which is used as a laser oscillation control mechanism and performs independent control on the first laser oscillating mechanism and the second laser oscillating mechanism.

Description

technical field [0001] The present invention relates to a laser (laser) processing device whose main function is to punch holes in objects to be processed such as printed circuit boards, and in particular to a multi-point simultaneous irradiation (type laser) for the purpose of improving production efficiency. ) laser processing device. Background technique [0002] A laser processing device is disclosed in the prior art. In order to improve production efficiency, a laser beam output by a laser oscillator (laser) is divided into two beams in the laser processing device, so that two laser beams can be used to process two laser beams at the same time. hole (for example, refer to Patent Document 1). In this laser processing device, one of the two beam-split laser beams is divided between two beams by the first galvanometer optical scanner (galvanometer scanner) and the second galvanometer optical scanner. Deflect (change the direction of travel) in the dimension direction (in...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/382B23K26/064B23K26/70
CPCB23K26/0648
Inventor 高桥悌史石塚智彦伊藤健治成濑正史金田充弘
Owner MITSUBISHI ELECTRIC CORP