Packaging substrate and manufacturing method thereof, and OLED display device and manufacturing method thereof
A technology for encapsulating substrates and manufacturing methods, which is applied in the direction of static indicators, semiconductor/solid-state device manufacturing, instruments, etc., can solve the problems of glass glue that cannot be cured, glass glue edge burrs, glass glue waste, etc., to improve the resistance to external water vapor and Oxygen intrusion ability, improvement of adhesion effect, effect of avoiding waste
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[0029] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0030] An embodiment of the present invention provides a packaging substrate, such as figure 1 and figure 2 As shown, the package substrate includes a base substrate 1, the base substrate 1 includes an adhesive area 11 for coating glass glue, and the package substrate also includes a first barrier wall 2 on the base substrate 1, the first barrier wall 2 is arranged along the outer edge of the bonding area 11, and the first retaining wall 2 is us...
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