Printed circuit board, package substrate, and method of fabricating the same

Abstract

A printed circuit board includes an insulating substrate, a plurality of pads on a top surface of the insulating substrate, a protective layer formed on the insulating substrate and having an opening to expose top surfaces of the pads, a bump formed on at least one of the pads and protruding upward of a surface of the protective layer. The bump has a curved lateral side.

Description

[0001] Cross References to Related Applications [0002] Pursuant to 35 U.S.C. § 119 and 35 § 365, this application claims priority to Korean Patent Application No. 10-2014-0080822 filed June 30, 2014, the entire contents of which are hereby incorporated by reference incorporated into this application. technical field [0003] The present embodiment relates to a printed circuit board, a packaging substrate and a manufacturing method thereof. Background technique [0004] Generally, the packaging substrate has a structure in which a first substrate to which a memory chip is attached is integrated with a second substrate to which a processor chip is attached. [0005] The package substrate is advantageous in that since the processor chip and the memory chip are integrated in the same package, the chip mounting area can be reduced and signals can be transmitted at a high rate. [0006] The package substrate is used in various mobile devices due to its advantages. [0007] f...

AI Technical Summary

Problems solved by technology

[0014] However, since the first substrate and the second substrate are connected using solder balls 7, the prior art has a limit in forming fine pitches.

[0015] In addition, according to the prior art, problems such as solder cracks, solder bridges, and solder collapse may occur due to the use of solder balls 7

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