Surface mount path optimization algorithm and high-speed surface mount machine based on algorithm

Abstract

The invention discloses a surface mount path optimization algorithm and a high-speed surface mount machine based on the algorithm. The surface mount machine comprises a support frame, a marble platform, a controller, an X-axis transmission control system, an Y-axis transmission control system, a surface mount workbench, a surface mount head, an automatic feeder and a surface mount chip calibration system, wherein the X-axis transmission control system, the Y-axis transmission control system, the surface mount workbench, the surface mount head, the automatic feeder and the surface mount chip calibration system are in signal connection with the controller, the automatic feeder is a double-material feeder, and the surface mount head is a high-speed surface mount head, and includes more than one rows of nozzles. The controller controls coordinated work of the systems, and selects, calculates and determines the corresponding position of the automatic feeder according to the position of a circuit board to be mounted and the type, amount and distribution information of the chip to be surface-mounted, components to be surface-mounted are rapidly picked in the shortest stroke in the picking process, operation time of the surface mount head is reduced, wearing of the transmission system is reduced, and the surface mount process is highly efficient and accurate.

Description

technical field [0001] The invention relates to a placement machine, in particular to a high-speed placement machine based on a placement path optimization algorithm designed to improve the placement speed, and belongs to the field of electronic placement equipment. Background technique [0002] In the field of electronic placement technology, a pick and place machine is a common device, which uses a suction nozzle on the pick and place head to pick up chips from an automatic feeder, and reciprocates the pick and place head through the X, Y-direction guide rails or lead screws on the pick and place machine. After the chip position is checked, the automatic chip placement process on the circuit board is finally completed. In this placement method, the circuit board is always in a static state, and the reciprocating and fast-moving placement head is used for continuous placement, which requires high accuracy and consistency of the moving position of the placement head. Among ...

AI Technical Summary

Problems solved by technology

Although this method can reduce the stroke and achieve the purpose of doubling the placement efficiency, the development space is limited. At the same time, the improvement process only focuses on the hardware, and there is no further improvement on the software.

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