Photoelectric sensor package and method therefor
A photoelectric sensor and packaging method technology, applied in the field of sensors, can solve the problems of poor refrigeration effect, lack of refrigeration devices, and inability to meet the low temperature work of sensors, and achieve the effects of easy sealing, reduced packaging difficulty, and avoiding continuous vacuuming procedures
Inactive Publication Date: 2016-01-20
NANJING CENT CHINA GEOLOGICAL SURVEY
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After searching, it was found that the Chinese patent application with publication number CN104538462A discloses a photoelectric sensor packaging structure and its method. Chips are bonded to the upper end of each substrate unit and are electrically connected to the substrate unit through leads. The advantage of this packaging structure is that it can package multiple chips at a time, but this structure lacks a cooling device, and natural cooling is usually used to provide photoelectric sensors. Low temperature environment, poor cooling effect, can not meet the requirements of low temperature sensor
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Embodiment 1
[0036] The photoelectric sensor package of the present embodiment has a structure such as figure 1As shown, it includes a housing, a detector element installed in the housing and a circuit board 5, wherein the housing is mainly composed of an upper housing cover 2 and a bottom cover plate 8 installed at the lower end of the upper housing cover 2, the upper housing cover 2 and the bottom The 8 cover plates are fixed and connected by screws, and the joints are sealed with sealant. The upper shell cover 2 and the bottom cover plate 8 are both made of brass, and the height of the bottom frame of the upper shell cover 2 is twice the thickness of the bottom cover plate 8 , the thickness of the upper cover plate 2 is consistent with the thickness of the bottom cover plate 8, not only to achieve the best cooling effect, but also to dissipate heat as soon as possible to prevent water condensation. The upper case cover 2 includes an upper cover plate 14 and four side walls 17 verticall...
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The invention relates to a photoelectric sensor package, and the package comprises a housing, a detector element, and a circuit board, wherein the detector element and the circuit board are disposed in the housing. The housing mainly consists of an upper cover and a bottom cover plate disposed at the lower end of the upper cover. The upper cover and the bottom cover plate are fixed through screws, and are sealed through sealing glue. The detector element comprises a ceramic substrate and a photoelectric sensor disposed on the ceramic substrate. Two opposite side surfaces of the ceramic substrate are respectively provided with a group of pin jacks, and the interiors of the pin jacks are provided with output pins which are electrically connected with a circuit of the photoelectric sensor through metal lines. The central part of the circuit board is provided with a groove in the length direction. The interior of the groove is provided with a semiconductor cooler. Parts, close to two sides of the groove, of the circuit board are respectively provided with a welding hole. The output pins of the sensor are inserted into the welding holes, and are connected with adapter pins of the circuit board at the outer sides of the welding holes. The package is small in size, is easy for packaging, is not liable to cause gas leakage, and is good in cooling effect.
Description
technical field [0001] The invention belongs to the technical field of sensors, and relates to a photoelectric sensor package and a method thereof. Background technique [0002] As far as the applicant knows, in the process of making photoelectric sensors, in order to save costs, manufacturers often make bare chips (that is, unpackaged detectors), such as Figure 4 The bare chip of the line array sensor shown is mainly composed of a ceramic substrate, a photoelectric sensor material embedded in the ceramic substrate, and pins protruding from the ceramic substrate. The prerequisite for the photoelectric sensor to realize imaging detection is that the working dark current of the device is very small. The most effective and commonly used method for reducing the working dark current of the sensor in the prior art is the cooling method, that is, the sensor needs to work under low temperature conditions, so the design of a A scientific and reasonable packaging structure to meet th...
Claims
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Login to View More IPC IPC(8): H01L31/0203H01L31/18
CPCH01L31/0203H01L31/18Y02P70/50
Inventor 修连存郑志忠
Owner NANJING CENT CHINA GEOLOGICAL SURVEY