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A device for eliminating epoxy resin bubbles on the surface of cbb60 capacitor

An epoxy resin and capacitor technology, applied in the direction of foam dispersion/prevention, etc., can solve the problems of moisture-proof performance discount, thorn, and affect the safety of capacitor electricity consumption, etc., and achieve the effect of high defoaming efficiency, elimination of air bubbles, and simple structure.

Active Publication Date: 2017-03-29
铜陵市佳龙飞电容器有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, a large number of CBB60 capacitors use open potting without a cover plate. In actual operation, a certain amount of air bubbles will appear on the surface of the product, especially at the root of the lead or insert. If it is not eliminated in time, after the epoxy is cured, its Bubbles on the surface will affect the safety of the capacitor, and the sealing and moisture-proof performance will be greatly reduced, seriously affecting the appearance of the capacitor. The traditional process is to use a toothpick to puncture the bubbles on the surface of the capacitor after the filling is completed, so as to achieve the purpose of defoaming. This method is labor-intensive and time-consuming, with many omissions and repeated pricking, the effect is not good

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  • A device for eliminating epoxy resin bubbles on the surface of cbb60 capacitor
  • A device for eliminating epoxy resin bubbles on the surface of cbb60 capacitor

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Embodiment Construction

[0013] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0014] In describing the present invention, it should be understood that the terms "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", The orientations or positional relationships indicated by "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present invention, rather than indicating or It should not be construed as limiting the invention by implying that a referenced device or element must have a particular orientation, be...

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Abstract

The invention relates to a device for eliminating epoxy resin bubbles on the surface of a CBB60 type capacitor. The device comprises a bubble eliminating box and an alcohol box arranged on the bubble eliminating box. A spray pipe and a fixed seat are arranged in the bubble eliminating box, the spray pipe is connected and communicated with the alcohol box through a connecting pipe, a flow regulating valve is arranged on the connecting pipe, multiple sprayers are arranged at the lower portion of the spray pipe, the fixed seat is arranged below the sprayers, and the fixed seat is provided with multiple capacitor containing holes corresponding to the sprayers one to one. The device is simple in structure, epoxy resin generating the bubbles is diluted through alcohol to achieve the bubble eliminating purpose, bubble eliminating efficiency is high, and the capacitor is not adversely affected after being treated due to the fact that the alcohol is prone to volatilization.

Description

technical field [0001] The invention relates to the technical field of capacitor production equipment, in particular to a device for eliminating bubbles of epoxy resin on the surface of a CBB60 capacitor. Background technique [0002] At present, a large number of CBB60 capacitors use open potting without a cover plate. In actual operation, a certain amount of air bubbles will appear on the surface of the product, especially at the root of the lead or insert. If it is not eliminated in time, after the epoxy is cured, its Bubbles on the surface will affect the safety of the capacitor, and the sealing and moisture-proof performance will be greatly reduced, seriously affecting the appearance of the capacitor. The traditional process is to use a toothpick to puncture the bubbles on the surface of the capacitor after the filling is completed, so as to achieve the purpose of defoaming. This method is labor-intensive and time-consuming, with many omissions and repeated pricking, so...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B01D19/04
Inventor 陈家宝
Owner 铜陵市佳龙飞电容器有限公司