A deformation-resistant and pressure-resistant equal temperature plate

Abstract

The invention discloses a deformation-resistant and pressure-resistant equal temperature plate, which comprises an upper cover plate, a lower cover plate and a supporting structure. The combination of the upper cover plate and the lower cover plate forms a closed accommodating space, and the supporting structure is located in the accommodating space. The support structure is composed of support columns whose cross-sectional size obeys the characteristics of fractal Brownian motion; the lower cover plate includes a heat-conducting substrate, an upper channel inlet plate and a lower channel outlet plate, and a condensing medium input port is arranged on the upper channel inlet plate. A condensing medium output port is set on the outlet plate of the lower channel, an upper flow channel is set on the inner side of the upper surface of the heat conduction substrate, and a lower flow channel is set on the inner side of the lower surface of the heat conduction substrate, both the upper flow channel and the lower flow channel are graded flow channels The network, the upper flow channel and the lower flow channel are connected through the upper and lower vertical channels arranged at the end of the final channel of the hierarchical flow channel network. The uniform temperature plate of the invention has strong deformation resistance and pressure resistance, high heat transfer efficiency, and the temperature on the surface of the lower cover plate of the uniform temperature plate is more uniform.

Description

technical field [0001] The invention relates to a heat exchange device, in particular to a deformation-resistant and pressure-resistant uniform temperature plate with a random fractal characteristic support structure designed to improve heat exchange performance. Background technique [0002] Vapor chamber is an extended application in the field of heat pipe technology. Its working principle is similar to that of heat pipes. The working medium absorbs heat and evaporates on the heating surface. The heat is brought to the condensation end by convection and released. The condensed working medium passes through the internal capillary tissue. Return to the heated end to achieve the purpose of recycling. This method of heat transfer using the phase change process of the working medium in a small space has the advantages of extremely high thermal conductivity, excellent isothermal properties, and environmental adaptability. At present, the optimal design of the vapor chamber main...

AI Technical Summary

Problems solved by technology

[0005] In order to solve the problem of poor deformation resistance and pressure resistance existing in the existing temperature chamber structure design, and the combination of structural strength and heat transfer efficiency of the chamber cannot be maximized, the present invention provides an internal support column according to the fractal Brown The uniform temperature plate arranged in motion features realizes the efficient heat transfer and resistance to deformation and pressure of the uniform temperature plate

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