The invention discloses a high temperature resistant organosilicone pouring sealant for a PCB (Printed Circuit Board). The high temperature resistant organosilicone pouring sealant for the PCB is prepared from the following raw materials in parts by weight: 40 to 50 parts of vinyl-terminated silicone oil-1, 50 to 60 parts of vinyl-terminated silicone oil-2, 0.38 to 0.5 part of 12 percent platinum catalyst, 0.02 to 0.04 part of ethynylcyclohexanol, 25 to 30 parts of vinyl silicone resin, 14.8 to 16.8 parts of 1-allyloxy-2,3-propylene oxide, 23 to 25 parts of 1,3,5,7-tetramethylcyclotetrasiloxane, 2.7 to 3.6 parts of silane coupling agent A171, a suitable amount of hydrogen-containing silicone oil, 3 to 3.8 parts of sepiolite fibres, 1.7 to 3 parts of aluminium nitride, 2 to 2.5 parts of sodium stearate, 1.5 to 2 parts of dodecylamine and a suitable amount of deionized water. The pouring sealant prepared by the preparation method is simple in preparation process, low in cost and wide in raw material source, has good performance in the aspects of radiating, high temperature resistance, stability, insulating and the like, is wide in application field, and is worth being popularized.