The invention discloses a high temperature resistant organosilicone pouring
sealant for a PCB (
Printed Circuit Board). The high temperature resistant organosilicone pouring
sealant for the PCB is prepared from the following raw materials in parts by weight: 40 to 50 parts of vinyl-terminated
silicone oil-1, 50 to 60 parts of vinyl-terminated
silicone oil-2, 0.38 to 0.5 part of 12 percent
platinum catalyst, 0.02 to 0.04 part of ethynylcyclohexanol, 25 to 30 parts of vinyl
silicone resin, 14.8 to 16.8 parts of 1-allyloxy-2,3-
propylene oxide, 23 to 25 parts of 1,3,5,7-tetramethylcyclotetrasiloxane, 2.7 to 3.6 parts of
silane coupling agent A171, a suitable amount of
hydrogen-containing
silicone oil, 3 to 3.8 parts of
sepiolite fibres, 1.7 to 3 parts of
aluminium nitride, 2 to 2.5 parts of
sodium stearate, 1.5 to 2 parts of dodecylamine and a suitable amount of deionized water. The pouring
sealant prepared by the preparation method is simple in preparation process, low in cost and wide in
raw material source, has good performance in the aspects of radiating, high
temperature resistance, stability, insulating and the like, is wide in application field, and is worth being popularized.