Medium-and-low-temperature curing single-component epoxy adhesive low in linear expansion coefficient and preparation method thereof

A linear expansion coefficient, epoxy adhesive technology, applied in the direction of adhesives, epoxy resin adhesives, adhesive types, etc., can solve the problems of high temperature curing and high linear expansion coefficient of one-component epoxy adhesives, saving resources, reducing Internal stress, the effect of avoiding strength reduction

Inactive Publication Date: 2016-06-15
上海拜高高分子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the problems of high temperature curing and high coefficient of linear expansion of current single-component epoxy adhesives

Method used

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  • Medium-and-low-temperature curing single-component epoxy adhesive low in linear expansion coefficient and preparation method thereof
  • Medium-and-low-temperature curing single-component epoxy adhesive low in linear expansion coefficient and preparation method thereof
  • Medium-and-low-temperature curing single-component epoxy adhesive low in linear expansion coefficient and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Embodiment 1 one-component epoxy adhesive

[0032] The reaction components are as follows,

[0033]

[0034]

[0035] According to the above-mentioned component weight table, the preparation method is as follows,

[0036] 1. Add bisphenol F epoxy resin, multifunctional epoxy resin, diluent, pigment, surfactant, coupling agent, and stir at low speed for a certain period of time;

[0037] 2. Add silicon micropowder, raise the temperature to 35°C, stir at a high speed and vacuumize, after stirring for 50 minutes, stop stirring, turn off the vacuum, and start to lower the temperature;

[0038] 3. After the temperature drops to 25°C, add latent curing agent, stir in vacuum at high speed for 15 minutes, and ensure that the temperature of the whole experiment is controlled below 35°C; the one-component epoxy adhesive is obtained.

Embodiment 2

[0039] Embodiment 2 one-component epoxy adhesive

[0040] The reaction components are as follows,

[0041]

[0042]

[0043] According to the above-mentioned component weight table, the preparation method is as follows,

[0044] 1. Add bisphenol F epoxy resin, multifunctional epoxy resin, diluent, pigment, surfactant, coupling agent, and stir at low speed for a certain period of time;

[0045] 2. Add silicon micropowder, heat up to 60°C, stir at a high speed and vacuumize, after stirring for 70 minutes, stop stirring, turn off vacuuming, and start to lower the temperature;

[0046] 3. After the temperature drops to 35°C, add latent curing agent, stir in vacuum at high speed for 30 minutes, and ensure that the temperature of the entire experiment is controlled below 35°C; the one-component epoxy adhesive is obtained.

Embodiment 3

[0047] Embodiment 3 one-component epoxy adhesive

[0048] The reaction components are as follows,

[0049] Bisphenol F epoxy resin

10 copies

multifunctional epoxy resin

10 copies

Thinner

3 copies

coupling agent

1 copy

Other additives

0.3 parts

paint

0.5 parts

Surfactant

0.1 part

Silica powder

600 copies

latent curing agent

5 copies

[0050] According to the above-mentioned component weight table, the preparation method is as follows,

[0051] 1. Add bisphenol F epoxy resin, multifunctional epoxy resin, diluent, pigment, surfactant, coupling agent, and stir at low speed for a certain period of time;

[0052] 2. Add silicon micropowder, raise the temperature to 55°C, stir at high speed and vacuumize, after stirring for 60 minutes, stop stirring, turn off the vacuum, and start to lower the temperature;

[0053] 3. After the temperature drops to 30°C, add latent curing a...

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Abstract

The invention provides a low linear expansion coefficient curable single-component epoxy adhesive at low temperature, which is formed by reacting the following components: bisphenol F epoxy resin; multifunctional epoxy resin; silicon micropowder; diluent; latent curing agent; coupling agent; and / or surfactant; and / or other auxiliary agents. The one-component epoxy adhesive involved in the invention is cured at medium and low temperature. The advantage of medium and low temperature curing can make the one-component epoxy adhesive be used in more applications, and at the same time save resources, reduce costs, and reduce curing time. the internal stress generated when.

Description

technical field [0001] The invention relates to the technical field of adhesives, in particular to a one-component epoxy adhesive with low linear expansion coefficient and medium-low temperature curing performance. Background technique [0002] The one-component epoxy adhesive is composed of epoxy resin and curing agent. It is a high-performance adhesive that does not need to be mixed with epoxy resin and curing agent. It is easy to use and can meet various requirements. The latent curing agent is in a powder state at room temperature, and its compatibility with epoxy resin is not very good, making it difficult to react with epoxy resin at room temperature. Once heated, the latent curing agent begins to melt, thereby achieving The better compatibility of the resin, which in turn initiates the curing of the epoxy resin. Latent curing agents used in one-part epoxy adhesives (often require) to cure at high temperatures, but not all applied materials can withstand such high tem...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/04
CPCC09J163/00C08L2201/08C08L2205/025C09J11/04
Inventor 冯景涛骆军魏宁波沈红燕陈杰
Owner 上海拜高高分子材料有限公司
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