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Anti-deformation pressure resistant temperature-uniforming plate

A vapor chamber and anti-deformation technology, which is applied to electrical components, electric solid devices, circuits, etc., can solve the problems that the structural strength and heat transfer efficiency of the vapor chamber cannot be maximized, and the anti-deformation and pressure resistance are not good. , to achieve the effect of improving life, heat transfer coefficient and uniform temperature

Active Publication Date: 2016-01-27
安徽瀚程机械制造有限公司
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  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the problem of poor deformation resistance and pressure resistance existing in the existing temperature chamber structure design, and the combination of structural strength and heat transfer efficiency of the chamber cannot be maximized

Method used

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  • Anti-deformation pressure resistant temperature-uniforming plate
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  • Anti-deformation pressure resistant temperature-uniforming plate

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[0026] The present invention will be further described with reference to the drawings:

[0027] The structure of the anti-deformation and pressure-resistant uniform temperature plate proposed by the present invention is as follows figure 1 As shown, the deformation-resistant and pressure-resistant uniform temperature plate mainly includes an upper cover plate 1, a lower cover plate 2 and a supporting structure 4. The upper cover plate 1 and the lower cover plate 2 form a closed accommodating space. Layer capillary structure. The capillary structure in contact with the upper cover plate 1 is a layer of metal oxide film deposited on the inner surface of the plate by chemical vapor deposition. The surface water contact angle is only about 10°, which greatly improves the hydrophilicity of the surface. This strengthens its water absorption capacity, so that the heat can be taken away by phase change heat transfer in time, preventing damage due to excessive thermal stress; the capilla...

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Abstract

The invention discloses an anti-deformation pressure resistant temperature-uniforming plate including an upper cover plate, a lower cover plate, and a support structure. The upper cover plate and the lower cover plate are combined to form an enclosed accommodating space, the support structure is arranged in the accommodating space, the support structure is formed by support columns being in plane-shaped distribution and having the cross section sizes following fractal Brownian motion characteristics, the lower cover plate includes a heat conduction substrate, an upper channel inlet plate, and a lower channel outlet plate, a condensation medium input port is arranged in the upper channel inlet plate, a condensation medium output port is arranged in the lower channel outlet plate, an upper-layer flow channel is arranged in the inner side of the upper surface of the heat conduction substrate, a lower-layer flow channel is arranged in the inner side of the lower surface of the heat conduction substrate, the upper-layer flow channel and the lower-layer flow channel are grading channel networks, and the upper-layer flow channel and the lower-layer flow channel are communicated via the upper and lower vertical channels at the final-stage ends of the grading channel networks. The temperature-uniforming plate is high in anti-deformation and pressure resistant properties and high in heat conduction efficiency, and the temperature of the surface of the lower cover plate of the temperature-uniforming plate is uniform.

Description

technical field [0001] The invention relates to a heat exchange device, in particular to a deformation-resistant and pressure-resistant uniform temperature plate with a random fractal characteristic support structure designed to improve heat exchange performance. Background technique [0002] Vapor chamber is an extended application in the field of heat pipe technology. Its working principle is similar to that of heat pipes. The working medium absorbs heat and evaporates on the heating surface. The heat is brought to the condensation end by convection and released. The condensed working medium passes through the internal capillary tissue. Return to the heated end to achieve the purpose of recycling. This method of heat transfer using the phase change process of the working medium in a small space has the advantages of extremely high thermal conductivity, excellent isothermal properties, and environmental adaptability. At present, the optimal design of the vapor chamber main...

Claims

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Application Information

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IPC IPC(8): H01L23/367H01L23/427
Inventor 陈永平黄永平丁奕文张程宾
Owner 安徽瀚程机械制造有限公司
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