Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Hearing aid interface circuit and method

An interface and circuit technology, applied in hearing aids, instruments, electrical components, etc., can solve the problem of chip consumption, and achieve the effect of high driving strength and low dynamic power consumption

Active Publication Date: 2020-06-05
GN HEARING AS
View PDF12 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Reliable transmission of digital signals between individual chips typically consumes a lot of power on the chip, primarily because of parasitic capacitance introduced by the pads of the interface and associated components and connections

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Hearing aid interface circuit and method
  • Hearing aid interface circuit and method
  • Hearing aid interface circuit and method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0044] Various features are described below with reference to the accompanying drawings. It should be noted that the figures may or may not be drawn to scale, and that elements of similar structure or function are represented by like reference numerals throughout the figures. It should be noted that the drawings are only intended to aid in describing the features. They are not intended as an exhaustive description of or as a limitation on the scope of the claimed invention. Additionally, an illustrated feature need not have all of the aspects or advantages shown. An aspect or advantage described in connection with a particular feature is not necessarily limited to that feature and may be practiced with any other feature even if not so stated or so explicitly described.

[0045] figure 1 It is a schematic diagram showing the main components of the interface pad circuit 1 for the microelectronic chip of the hearing aid according to the first embodiment. The interface pad cir...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

An interface pad circuit configured for conveying an electrical signal from a semiconductor chip component to a component external to the semiconductor chip component, the interface pad circuit includes: a control circuit; a plurality of semiconductor elements, the semiconductor elements having respective bulk terminals and being controlled by the control circuit; and a connection pad; wherein at least two of the semiconductor elements are configured for providing a plurality of non-zero logic voltage levels to the connection pad; and wherein the control circuit is configured to apply a voltage level to the bulk terminals of the at least two of the semiconductor elements providing the non-zero logic voltage levels, the voltage level applied by the control circuit corresponding to the highest voltage level of the plurality of non-zero logic voltage levels.

Description

technical field [0001] This disclosure relates to hearing aids. More specifically, the present disclosure relates to hearing aids that include multiple integrated electronic circuits. Background technique [0002] Modern hearing aids include very large scale integrated electronic circuits in order to accommodate the necessary circuitry to perform the desired function of the hearing aid while keeping the physical size of the hearing aid as small as possible. This means that the chip or die containing the semiconductor components of the hearing aid must also be as small as possible to fit into the hearing aid housing. There is also a need to optimize the circuit to use as little power as possible in order to prolong the life of the battery powering the hearing aid. [0003] Due to many practical problems, it is often necessary to distribute the circuit over several silicon dies and to provide interconnections between parts of the circuits that exist on different silicon dies...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H04R25/00
CPCG05F1/46H04R25/505H04R2460/03
Inventor H·阿伦特
Owner GN HEARING AS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com