Hearing aid interface circuit and method

Abstract

An interface pad circuit configured for conveying an electrical signal from a semiconductor chip component to a component external to the semiconductor chip component, the interface pad circuit includes: a control circuit; a plurality of semiconductor elements, the semiconductor elements having respective bulk terminals and being controlled by the control circuit; and a connection pad; wherein at least two of the semiconductor elements are configured for providing a plurality of non-zero logic voltage levels to the connection pad; and wherein the control circuit is configured to apply a voltage level to the bulk terminals of the at least two of the semiconductor elements providing the non-zero logic voltage levels, the voltage level applied by the control circuit corresponding to the highest voltage level of the plurality of non-zero logic voltage levels.

Description

technical field

[0001] This disclosure relates to hearing aids. More specifically, the present disclosure relates to hearing aids that include multiple integrated electronic circuits. Background technique

[0002] Modern hearing aids include very large scale integrated electronic circuits in order to accommodate the necessary circuitry to perform the desired function of the hearing aid while keeping the physical size of the hearing aid as small as possible. This means that the chip or die containing the semiconductor components of the hearing aid must also be as small as possible to fit into the hearing aid housing. There is also a need to optimize the circuit to use as little power as possible in order to prolong the life of the battery powering the hearing aid.

[0003] Due to many practical problems, it is often necessary to distribute the circuit over several silicon dies and to provide interconnections between parts of the circuits that exist on different silicon dies...

Images