Cooling device for cooling electronic and/or electric element in targeted manner

A technology for cooling devices and electrical components, used in electrical components, electrical equipment structural parts, output power conversion devices, etc. Effect

Active Publication Date: 2016-01-27
VALEO EAUTOMOTIVE GERMANY GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This lost heat impairs the functionality and lifetime of the electronic and / or electrical components, so efficient heat dissipation is required, ie a cost-effective but efficient removal of the lost heat is required

Method used

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  • Cooling device for cooling electronic and/or electric element in targeted manner
  • Cooling device for cooling electronic and/or electric element in targeted manner
  • Cooling device for cooling electronic and/or electric element in targeted manner

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0033] figure 1 A three-dimensional representation of a cooling body 4 is shown in , which is conventionally used, for example, for cooling electronic and / or electrical components. The cooling body 4 has an inlet 11 for the delivery 13 of the cooling medium and an outlet 12 for the discharge 14 of the cooling medium 7 . The cooling medium 7 surrounds the plurality of raised cooling elements 5 of the cooling body 4 by means of a layered one-dimensionally structured, partially partially swirled flow direction 15 . Since the intensity and duration of the heat dissipation of the cooling body 4 are not the same at every point of the cooling body 4 , the cooling medium 7 is in most cases for all the amount of heat to be output by the cooling body 4 This amount of heat can only be absorbed and dissipated completely by means of the loose design and often over-spec construction of the cooling system. The cooling of the electronic and / or electrical components thermally coupled to the ...

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PUM

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Abstract

The invention relates to a cooling device for cooling an electronic and/or electric element, particularly a power semiconductor which is configured on a circuit board. The device is provided with the components of at least one cooling member which is provided with projected heat radiating members which are configured on the surface of the cooling member, wherein the cooling member is thermally coupled with the electronic and/or electric element; at least one cooling medium distributing member which is used for spatially distributing cooling medium to hot spots which are defined by the cooling member in a targeted manner; a cooling device inner chamber which is surrounded by the cooling member and a cooling member tank that can be connected with the cooling member, wherein the cooling device inner chamber at least comprises the projected heat radiating member of the cooling member and the cooling medium distributing member; at least one inlet for conveying the cooling medium into the cooling device inner chamber; and at least one outlet for discharging the cooling medium out of the cooling device inner chamber. Furthermore the cooling device is applied in a converter, and particularly the converter of an electric vehicle or hybrid electric vehicle.

Description

technical field [0001] The invention relates to a cooling device for cooling electronic and / or electrical components, in particular power semiconductors arranged on a circuit board, having at least one cooling body with protruding heat sinks arranged on the surface of the cooling body components, wherein the cooling body is provided for thermal coupling with electronic and / or electrical components. Background technique [0002] Electronic and / or electrical components, as they are used, for example, in industrial converters or in converters for electric or hybrid vehicles, are usually designed for high Electric continuous power and peak power. During operation, these electronic and / or electrical components cause in most cases non-negligible electrical losses, which are mostly converted into loss heat. This heat loss impairs the functionality and lifetime of the electronic and / or electrical components, so efficient heat dissipation is required, that is to say cost-effective ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H02M1/00
CPCH01L23/473B60L50/00H01L23/3672H01L2924/0002H05K7/20927H01L2924/00
Inventor 米夏埃尔·莱佩纳特克里斯蒂安·卢茨
Owner VALEO EAUTOMOTIVE GERMANY GMBH
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