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A kind of epoxy resin photoelastic model and its making method

A technology of epoxy resin and production method, which is applied in the field of experimental mechanics research, and can solve problems such as physical hazards, cumbersome steps, and increased complexity and difficulty of photoelastic experiments

Active Publication Date: 2018-01-05
CHINA UNIV OF MINING & TECH (BEIJING)
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] At present, some scholars have summarized several formulas for making epoxy resin models, but these formulas have the disadvantages of complex production process, cumbersome steps, and long production cycle. Some of the raw materials used in some formulas are also toxic, which is very harmful to the body.
These problems have greatly increased the complexity and difficulty of photoelasticity experiments and affected the progress of photoelasticity experiments.

Method used

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  • A kind of epoxy resin photoelastic model and its making method
  • A kind of epoxy resin photoelastic model and its making method
  • A kind of epoxy resin photoelastic model and its making method

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specific Embodiment approach

[0025] A kind of new formula and preparation method of making epoxy resin photoelastic model of the present invention, its preferred embodiment is:

[0026] refer to Figure 1-Figure 4 . According to the needs of the experiment, select the organic glass spacer 11 and two glass plates 13 of suitable size. In the present embodiment, the organic glass spacer 11 is a "U" type organic glass frame with a thickness of 8mm, and the size of the two glass plates 13 is the same , its length × width × thickness is 410mm × 305mm × 6mm. First, use a small brush to evenly brush the 704 sealant on the inner side of the "U" shape of the plexiglass spacer 11. The thickness of the brush is about 3-5 mm. Wait for the 704 sealant to solidify naturally to form an elastic inner core with a thickness of 3-5 mm. 12. Simultaneously two glass plates 13 are cleaned with clear water, then wipe glass plates 13 with the medical absorbent cotton dipped in alcohol, the glass plates 13 surfaces are wiped br...

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Abstract

The invention discloses an epoxy resin photoelastic model and a manufacturing method thereof. A mixed liquid is prepared by using four raw materials of 618# epoxy resin, methyl hexahydrophthalic anhydride, accelerator DMP‑30 and epoxy resin defoamer; When mixing the liquid, first pour the weighed methyl hexahydrophthalic anhydride and epoxy resin defoamer into the epoxy resin and start stirring. pour the mixed solution into the mold; after pouring, put the mold into the oven to heat to solidify the mixed solution; after the heating process, take the mold out of the oven and remove the mold to obtain the formed model; The formed model is put into an oven for annealing to obtain an epoxy resin photoelastic model. The reaction process of the mixed solution prepared by the formula is not violent, the curing time is short, the curing process is simple, the internal residual stress of the model is small, and the toxicity of the chemical raw materials used is small.

Description

technical field [0001] The invention relates to the field of experimental mechanics research, in particular to an epoxy resin photoelastic model and a manufacturing method thereof. Background technique [0002] The photoelastic method is a branch of experimental mechanics. This method is to use optically sensitive materials to make a model similar to the real object, or to paste optically sensitive materials on actual components. Under the corresponding load, irradiate with polarized light and calculate The law of stress variation on the surface and inside can be obtained. The stress components obtained by this method have sufficient precision for engineering design. It has strong intuitiveness, high reliability and wide adaptability, and can obtain all stress states under various complex conditions. Especially for components with complex shapes, complex loads and stress concentration, which are difficult to calculate theoretically, the photoelastic method can show its supe...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C39/02B29C39/26B29C33/38B29C71/02C08L63/00C08G59/42
Inventor 岳中文王煦邱鹏陈程胡庆文
Owner CHINA UNIV OF MINING & TECH (BEIJING)