Glass working method, glass etching liquid and glass substrate

Abstract

The present invention provides a glass working method, a glass etching a liquid and glass substrate. The glass processing may be performed with no need for allowing the top of the top portion extruding outside and facing the surface of a glass substrate to be not located at the outer side of surface of the glass substrate. The glass working method comprises: a first glass etching step, a first glass etching liquid containing hydrofluoric acid of 0.5 to 20 mass%, nitric acid of 5.0 to 25 mass% and inorganic acid of 0.5 to 10 mass% except hydrofluoric acid and nitric acid is used, a pair of glass substrates with the same pattern etching masking on a main plane is subjected to etching; and a second glass etching step, a second glass etching liquid containing hydrofluoric acid of 0.5 to 20 mass% and sulfuric acid of 10 to 50 mass%, and the glass substrate etched in the first glass etching step is etched.

Description

technical field [0001] The invention relates to a glass processing method, a glass etchant, and a glass substrate. Background technique [0002] In portable electronic devices such as smartphones, glass substrates are used as components of touch panels and as cover glasses for protecting image display panels. [0003] Conventionally, physical methods are generally used as processing methods for such glass substrates. However, cracks tend to be formed during processing, resulting in a decrease in strength and deterioration in yield. [0004] Therefore, in recent years, a method for obtaining a glass substrate of a desired shape by forming a resist pattern of a desired shape on a glass substrate and etching a glass substrate with the resist pattern as a mask (for example, referring to Patent No. Literature 1). According to this chemical method, since no physical load is applied during processing, cracks are less likely to be formed. In addition, unlike the physical method, ...

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Problems solved by technology

[0003] In the past, the processing method of such a glass substrate was generally a physical method, but cracks were easily formed during processing, resulting in a decrease in strength and a deterioration in yield.

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