2 results about "Physical load" patented technology

The application provides a door and window processing parameter optimization method and system, relates to the door and window processing field, and obtains door and window parameters and external environment information, establishes a door and window simulation model according to the door and window parameters, converts the external environment information into physical load parameters, then performs accelerated simulation operation on the door and window simulation model based on the physical load parameters, obtains door and window performance evaluation results, and finally generates door and window design optimization information according to the evaluation results, and simulates the long-term performance of the door and window within a preset time period by applying multiple frequency load cycles. Through the technical scheme, the application can effectively solve the problem that the existing technology lacks accurate prediction and evaluation capability for the small local deformation of the super-large size and slender profile door and window under the long-term complex environment and the cumulative influence of the small local deformation on the long-term reliability and optical quality of the door and window, and avoids the performance attenuation and quality problems that may occur in the actual application of the traditional method.

This invention relates to the field of chip performance monitoring technology, and discloses a method for monitoring and evaluating the performance of chips throughout their entire lifecycle based on big data. This method first extracts key physical characteristics of each bare die at the manufacturing stage, generates individual chip quality factors, and writes them into a one-time programmable memory area. Then, at the application stage, it collects the junction temperature of each layer in real time, calculates the vertical temperature gradient vector and local absolute temperature, and constructs a thermo-coupled instantaneous interface mechanical damage rate model based on the quality factors to quantify the instantaneous interface mechanical damage rate. Furthermore, it introduces a business weight coefficient to couple electrical wear with cumulative thermo-mechanical fatigue damage, calculating the chip's remaining health. Finally, based on the health warning threshold, it executes a vertical wear balancing strategy to migrate the data of damaged layers to a safe level. This invention solves the problem that traditional chip performance monitoring cannot detect the risk of microscopic thermal mismatch within the stacked structure, and avoids sudden physical failures of the chip through proactive physical load redistribution.