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Integrated Transformer

A technology that integrates transformers and primary windings. It is applied in the field of electronics and can solve problems such as damage and deterioration of primary windings.

Active Publication Date: 2018-01-16
STMICROELECTRONICS SRL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This local concentration of the electric field due to the effect of the edges can cause degradation of the primary winding until it fails (or burns out), thereby impairing or even preventing the operation of the transformer (and thus the SoC to which the circuit belongs)

Method used

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Examples

Experimental program
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Embodiment Construction

[0022] With reference to the accompanying drawings, Figure 1A and Figure 1B are respectively a schematic cross-sectional view and a plan view of a part of a system-on-chip 100 including an integrated transformer 105 according to an embodiment.

[0023] The system-on-chip 100 includes an integration portion 110 comprising one or more layers of semiconductor material in which semiconductor electronic components (not shown for simplicity) of the system-on-chip 100 are formed.

[0024] The system-on-chip 100 also includes a first metallic layer M ranging from 1 to the last metallic layer M N (exist Figure 1A In the example of N=5) multiple metallic layers (e.g., in Figure 1A five in the example), the last metallic layer M N typically used to form electrical contact pads where only pad 115 is in Figure 1A and Figure 1B As can be seen in , it is used to electrically couple the electronic components in the integrated part 110 with the accompanying external components (fo...

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PUM

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Abstract

The integrated transformer includes primary and secondary windings each having coils in a helical planar arrangement. A dielectric portion of dielectric material is interposed between the primary winding and the secondary winding. The field plate winding is electrically coupled to the primary winding. The field plate winding includes at least one field plate coil having a first lateral extension that is larger than a second lateral extension of a primary outer coil of the primary winding. The field plate coil overlaps the primary outer coil of the primary winding in plan view.

Description

[0001] priority claim [0002] This application claims priority from Italian Patent Application No. MI2014A001088 filed June 16, 2014, the disclosure of which is incorporated by reference. technical field [0003] The present invention relates to the field of electronics. In more detail, the invention relates to integrated inductive components, in particular integrated transformers. Background technique [0004] Transformers are widely used components in the electronics industry, especially in radio frequency electronics (eg, transceivers) and power electronics (eg, voltage converters). [0005] The constant process of miniaturization (scaling) of electronic circuits and subsequent development of (electronic) System-on-Chip (SoC) devices (i.e., complex electronic systems integrated on a chip semiconductor material (e.g., silicon)) has led to the provision of miniaturized integrated inductors converter, and results in the provision of integrated transformers which allow th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01F27/28
CPCH01F27/2804H01L23/5227H01L23/645H01L27/08H01F41/063H01L2924/0002H01F2027/2809H01L23/66H01L2223/64H01F27/323Y10T29/49021H01L2924/00H01F27/32
Inventor V·帕鲁姆博G·吉迪尼E·卡罗洛F·F·R·托亚
Owner STMICROELECTRONICS SRL