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Manufacturing method for circuit board with through hole

A processing method and circuit board technology, which is applied in the direction of removing conductive materials by chemical/electrolytic methods, forming electrical connections of printed components, etc., can solve the problem of metallized through-hole copper open circuit, easy cracking, and limited ability of dry film sealing And other issues

Active Publication Date: 2016-02-10
SHENNAN CIRCUITS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] An embodiment of the present invention provides a processing method for a circuit board with through holes to solve the problem that the dry film in the prior art is easily broken due to the limited sealing ability, and the copper of the metallized through holes will be etched away and the circuit will be broken, resulting in Defects

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  • Manufacturing method for circuit board with through hole
  • Manufacturing method for circuit board with through hole
  • Manufacturing method for circuit board with through hole

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Embodiment 1

[0016] Please refer to figure 1 , an embodiment of the present invention provides a method for processing a circuit board with a through hole, which may include:

[0017] 110. Processing metallized through holes on the circuit board.

[0018] The method in the embodiment of the present invention is used for processing a circuit board with metallized through holes. In this paper, starting from the step of drilling through holes on the circuit board, the method of the embodiment of the present invention is introduced. Before the step of drilling through holes, any existing technology can be used to make a circuit board that has not yet been drilled. No restrictions.

[0019] The circuit board mentioned in this article can be a double-sided copper clad laminate, or a multilayer board based on double-sided copper clad laminates. The first surface of the circuit board, and the second surface opposite to the first surface, respectively have a first surface metal layer and a secon...

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Abstract

The invention discloses a manufacturing method for a circuit board with a through hole, for solving the shortcoming of short circuit caused by that the hole copper of a metalized through hole is etched out due to the reasons that the dry film hole-sealing capacity is limited and the dry film is cracked easily. According to a certain feasible implementation mode of the manufacturing method, the manufacturing method comprises the steps of manufacturing the metalized through hole in the circuit board; plugging a plug pad in the metalized through hole; and setting an anti-etching film for covering the metalized through hole and a circuit pattern region on the surface of the circuit board, and etching the circuit board to form the required circuit pattern.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a processing method for a circuit board with through holes. Background technique [0002] For circuit boards with through holes, after processing the metallized through holes, it is necessary to set a dry film on the surface of the circuit board to protect the metallized through holes and the circuit pattern area, and then perform etching to remove the non-circuit patterns that are not protected by the dry film. The area is etched away to form the desired circuit pattern. [0003] Among them, the sealing ability of the dry film to the metallized through-hole is limited, and the diameter of the sealed through-hole should not be too large. When the diameter of the metallized via is large, for example greater than 5 mm, the dry film is very easy to crack. Cracking of the dry film will cause the etching solution to enter the metallized through hole from the cracked part of t...

Claims

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Application Information

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IPC IPC(8): H05K3/42H05K3/06
Inventor 黄立球刘宝林沙雷
Owner SHENNAN CIRCUITS