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Electronic component mounting system and electronic component mounting method

An electronic component installation and electronic component technology, applied in the direction of electrical components, electrical components, etc., can solve problems such as unqualified substrates, product quality decline, and identifier reading operations are not properly performed, and achieve suppression of unqualified substrates, suppression The effect produced

Active Publication Date: 2019-07-05
JUKI CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] For example, if the reading of the identifier is not performed properly due to human error, etc., electronic parts that should not be mounted may be mounted on the board
As a result, defective substrates may be produced, degrading the quality of products produced by electronic component mounting systems

Method used

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  • Electronic component mounting system and electronic component mounting method
  • Electronic component mounting system and electronic component mounting method
  • Electronic component mounting system and electronic component mounting method

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach ＞

[0094] The first embodiment will be described. figure 1 It is a schematic diagram which shows an example of the electronic component mounting system 100 which concerns on this embodiment. figure 2 It is a perspective view which shows an example of the mounting apparatus 1 which concerns on this embodiment.

[0095] Such as figure 1 As shown, the electronic component mounting system 100 has the mounting apparatus 1 which mounts the electronic component C on the board|substrate P, and the server 3 which manages the mounting apparatus 1. As shown in FIG. The mounting apparatus 1 has the supply apparatus 2 which can supply the electronic component C, and mounts the electronic component C of the supply apparatus 2 on the board|substrate P. As shown in FIG.

[0096] In this embodiment, the electronic component mounting system 100 has a plurality of mounting apparatuses 1 . The supply device 2 is provided on each of the plurality of mounting devices 1 . The server 3 and each of ...

no. 2 Embodiment approach ＞

[0243] A second embodiment will be described. In the following description, the same reference numerals are assigned to the same or equivalent components as those of the above-mentioned embodiment, and the description thereof is simplified or omitted.

[0244] In the above-mentioned first embodiment, when it is determined that the remaining number of electronic components C of the feeder 21 is zero, the operation device 51 is invalidated. In this embodiment, an example will be described in which the operating device 51 is disabled when it is determined that the remaining number of electronic components C in the feeder 21 is less than or equal to the first threshold and the number of retries is greater than or equal to the second threshold. When it is determined that the remaining number of electronic components C in the feeder 21 is greater than the first threshold value, the operation device 51 is not invalidated.

[0245] In the present embodiment, when the invalidation uni...

no. 3 Embodiment approach

[0278] A third embodiment will be described. In the following description, the same reference numerals are assigned to the same or equivalent components as those of the above-mentioned embodiment, and the description thereof is simplified or omitted.

[0279] In this embodiment, an example in which the feeder 21 is an electric feeder will be described. Figure 10 It is a schematic diagram which shows an example of the electric power supplier 210. FIG. Electric power supplier 210 is supplied with electric power from power supply device 220 . The electric feeder 210 has a motor, and supplies the holding belt with power generated by the motor.

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PUM

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Abstract

Provided is an electronic component mounting system capable of suppressing generation of defective substrates. This electronic component mounting system includes: a supply device capable of supplying electronic components; a mounting device that holds the electronic component with a holding member and mounts it on a substrate; an identification information acquisition unit that acquires identification information indicating the identification of the electronic component; An electronic component information acquisition unit that acquires authorized electronic component information indicating electronic components that should be mounted on a substrate; a component comparison unit that compares identification information with authorized electronic component information to determine whether the electronic component of the supply device is to be mounted on a substrate electronic components; a control unit that controls the mounting device based on the judgment result of the parts comparison unit; an operation device that generates an operation signal that converts a negative judgment by the parts comparison unit into an affirmative judgment; a remaining quantity information acquisition unit that acquires the remaining quantity information ; The invalidation unit invalidates the operating device based on the remaining quantity information.

Description

technical field [0001] The present invention relates to an electronic component mounting system and an electronic component mounting method. Background technique [0002] The electronic component mounting system includes a mounting device called a mounter that mounts electronic components supplied from a supply device on the surface of a substrate. As a form of a supply apparatus, the form disclosed by patent document 1 and patent document 2 which supplies the electronic component held by the holding tape, for example is known. The supply device includes a feeder called a feeder. A reel around which a holding tape holding an electronic component is wound is supported on the feeder. [0003] Patent Document 1: Japanese Patent No. 4135445 [0004] Patent Document 2: Japanese Patent Laid-Open No. 2002-299899 [0005] In order to identify an electronic component, an operation of reading an identifier provided on a reel is performed. Through this reading operation, identific...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K13/04
CPCH05K13/021H05K13/0417H05K13/084H05K13/085H05K13/086
Inventor 宫本哲朗
Owner JUKI CORP
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