Heat radiation rack and laser

Abstract

The invention discloses a heat radiation rack and a laser. The heat radiation rack is used for bearing a heating device, and is used for heat radiation of the heating device; the heat radiation rack includes a plurality of cooling fins; the heat radiation rack is formed by means of lamination of the plurality of cooling fins; a heat radiation channel is enclosed between every two adjacent cooling fins and / or each cooling fin is provided with the heat radiation channel; and each heat radiation channel penetrates through the heat radiation rack. Through the above modes, the heat radiation rack can select a suitable number of cooling fins to laminate to form the heat radiation rack according to different heat radiation demands, and can use the fewest cooling fins to manufacture the heat radiation rack, on the basis of satisfying the heat radiation demand for the heating device so that the cost of the heat radiation rack is reduced.

Description

technical field [0001] The invention relates to the technical field of heat dissipation, in particular to a heat dissipation frame and a laser. Background technique [0002] A laser is a device that uses the principle of stimulated radiation to amplify or oscillate light in certain excited substances. Lasers are mainly used in marking, communication, spectrum, ranging, radar, cutting, weapons, records, instructions, vision correction, beauty, scanning, mosquito killing and other fields. [0003] As the application fields of lasers become wider and wider, the requirements for cost and heat dissipation are getting higher and higher. For lasers with the same hundred-watt-level power, there are currently two main heat dissipation methods: water cooling and air cooling. The water-cooling method requires the production of a water-cooled plate, which has complicated processing technology and high cost. At the same time, it needs to be cooled by an external water cooler, which als...

AI Technical Summary

Problems solved by technology

The water-cooling method requires the production of a water-cooled plate. Its processing technology is complicated and the cost is high. At the same time, it needs to be cooled by an external water cooler, which also increases the cost

The air-cooled method uses traditional heat sinks and fans to dissipate heat, but its volume is large and the heat dissipation effect is average, especially when the volume is strictly limited, it is impossible to achieve high-power heat dissipation

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